LPC1343FBD48,151 NXP Semiconductors, LPC1343FBD48,151 Datasheet - Page 52

• Manufacturer Part Number: LPC1343FBD48,151
• Description: IC MCU 32BIT 32KB FLASH 48LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC13xxr

Specifications of LPC1343FBD48,151

• Program Memory Type: FLASH
• Program Memory Size: 32KB (32K x 8)
• Package / Case: 48-LQFP
• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 72MHz
• Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number Of I /o: 40
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC13
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 8 KB
• Interface Type: I2C, UART
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 42
• Number Of Timers: 4
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, KSK-LPC1343
• Development Tools By Supplier: OM11039, OM11040, OM11046, OM11048
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 8 Channel
• Cpu Family: LPC1000
• Device Core: ARM Cortex-M3
• Device Core Size: 32b
• Frequency (max): 72MHz
• Total Internal Ram Size: 8KB
• # I/os (max): 42
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 2V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 48
• Package Type: LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4945; 935289652151

NXP Semiconductors
LPC1311_13_42_43
Product data sheet
11.3 XTAL Printed-Circuit Board (PCB) layout guidelines
Table 19.
Table 20.
The crystal should be connected on the PCB as close as possible to the oscillator input
and output pins of the chip. Take care that the load capacitors C
third overtone crystal usage have a common ground plane. The external components
must also be connected to the ground plain. Loops must be made as small as possible in
order to keep the noise coupled in via the PCB as small as possible. Also parasitics
should stay as small as possible. Values of C
accordingly to the increase in parasitics of the PCB layout.
Fundamental oscillation
frequency F
1 MHz - 5 MHz
Fundamental oscillation
frequency F
15 MHz - 20 MHz
5 MHz - 10 MHz
10 MHz - 15 MHz
15 MHz - 20 MHz
20 MHz - 25 MHz
Recommended values for C
components parameters) low frequency mode
Recommended values for C
components parameters) high frequency mode
OSC
OSC
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 10 August 2010
Crystal load
capacitance C
10 pF
20 pF
30 pF
10 pF
20 pF
30 pF
10 pF
20 pF
10 pF
Crystal load
capacitance C
10 pF
20 pF
10 pF
20 pF
X1
X1
/C
/C
L
L
X2
X2
in oscillation mode (crystal and external
in oscillation mode (crystal and external
Maximum crystal
series resistance R
< 300 Ω
< 300 Ω
< 300 Ω
< 300 Ω
< 200 Ω
< 100 Ω
< 160 Ω
< 60 Ω
< 80 Ω
Maximum crystal
series resistance R
< 180 Ω
< 100 Ω
< 160 Ω
< 80 Ω
x1
and C
32-bit ARM Cortex-M3 microcontroller
LPC1311/13/42/43
x2
should be chosen smaller
x1
S
S
, C
x2
External load
capacitors C
18 pF, 18 pF
39 pF, 39 pF
57 pF, 57 pF
18 pF, 18 pF
39 pF, 39 pF
57 pF, 57 pF
18 pF, 18 pF
39 pF, 39 pF
18 pF, 18 pF
External load
capacitors C
18 pF, 18 pF
39 pF, 39 pF
18 pF, 18 pF
39 pF, 39 pF
, and C
© NXP B.V. 2010. All rights reserved.
x3
in case of
X1
X1
, C
, C
52 of 62
X2
X2