LPC2361FBD100,551 NXP Semiconductors, LPC2361FBD100,551 Datasheet - Page 41

IC ARM7 MCU FLASH 64K 100LQFP

LPC2361FBD100,551

Manufacturer Part Number
LPC2361FBD100,551
Description
IC ARM7 MCU FLASH 64K 100LQFP
Manufacturer
NXP Semiconductors
Series
LPC2300r
Datasheet

Specifications of LPC2361FBD100,551

Program Memory Type
FLASH
Program Memory Size
64KB (64K x 8)
Package / Case
100-LQFP
Core Processor
ARM7
Core Size
16/32-Bit
Speed
72MHz
Connectivity
CAN, I²C, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
70
Ram Size
34K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 6x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC23
Core
ARM7TDMI-S
Data Bus Width
16 bit, 32 bit
Data Ram Size
34 KB
Interface Type
CAN/I2S/SPI/SSP/USB
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
70
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
6-ch x 10-bit
On-chip Dac
1-ch x 10-bit
Package
100LQFP
Device Core
ARM7TDMI-S
Family Name
LPC2000
Maximum Speed
72 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
568-4310 - EVAL BOARD LPC2158 W/LCDMCB2360UME - BOARD EVAL MCB2360 + ULINK-MEMCB2360U - BOARD EVAL MCB2360 + ULINK2568-4014 - BOARD EVAL FOR LPC236X ARM568-3999 - BOARD EVAL FOR LPC23 ARM MCU
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4525
935286991551

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LPC2361FBD100,551
Quantity:
9 999
Part Number:
LPC2361FBD100,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
10. Dynamic characteristics
Table 6.
T
[1]
[2]
[3]
Table 7.
C
[1]
LPC2361_62_4
Product data sheet
Symbol
ARM processor clock frequency
f
External clock
f
T
t
t
t
t
I
t
SSP interface
t
Symbol
t
t
t
V
t
t
t
t
t
t
oper
osc
CHCX
CLCX
CLCH
CHCL
2
f(o)
su(SPI_MISO)
r
f
FRFM
FEOPT
FDEOP
JR1
JR2
EOPR1
EOPR2
amb
L
cy(clk)
C-bus pins (P0[27] and P0[28])
CRS
= 50 pF; R
Parameters are valid over operating temperature range unless otherwise specified.
Typical ratings are not guaranteed. The values listed are at room temperature (25 °C), nominal supply voltages.
Bus capacitance C
Characterized but not implemented as production test. Guaranteed by design.
=
40
°
Dynamic characteristics
Dynamic characteristics of USB pins (full-speed)
C to +85
pu
= 1.5 k
Parameter
operating frequency
oscillator frequency
clock cycle time
clock HIGH time
clock LOW time
clock rise time
clock fall time
output fall time
SPI_MISO set-up time
Parameter
rise time
fall time
differential rise and fall time
matching
output signal crossover voltage
source SE0 interval of EOP
source jitter for differential transition
to SE0 transition
receiver jitter to next transition
receiver jitter for paired transitions
EOP width at receiver
EOP width at receiver
b
°
C for commercial applications; V
in pF, from 10 pF to 400 pF.
Ω
on D+ to V
DD(3V3)
, unless otherwise specified.
Conditions
CCLK; −40 °C to +85 °C
IRC; −40 °C to +85 °C
V
T
in SPI Master mode; see
Figure 12
amb
IH
to V
= 25 °C; measured
Rev. 04 — 4 March 2010
IL
DD(3V3)
Conditions
10 % to 90 %
10 % to 90 %
see
see
10 % to 90 %
must reject as
EOP; see
Figure 11
must accept as
EOP; see
Figure 11
t
r
/ t
f
Figure 11
Figure 11
over specified ranges.
Min
1
3.96
1
42
T
T
-
-
20 + 0.1 × C
-
[1]
[1]
cy(clk)
cy(clk)
Min
8.5
7.7
-
1.3
160
−2
−18.5
−9
40
82
× 0.4
× 0.4
[1]
b
Single-chip 16-bit/32-bit MCU
[3]
Typ
-
-
-
-
-
-
-
-
-
-
Typ
-
4
-
-
-
-
-
-
-
11
LPC2361/62
[2]
© NXP B.V. 2010. All rights reserved.
Max
13.8
13.7
109
2.0
175
+5
+18.5
+9
-
-
Max
72
4.04
25
1000
-
-
5
5
-
-
Unit
ns
ns
%
V
ns
ns
ns
ns
ns
ns
41 of 57
Unit
MHz
MHz
MHz
ns
ns
ns
ns
ns
ns
ns

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