LPC2361FBD100,551 NXP Semiconductors, LPC2361FBD100,551 Datasheet - Page 50

IC ARM7 MCU FLASH 64K 100LQFP

LPC2361FBD100,551

Manufacturer Part Number
LPC2361FBD100,551
Description
IC ARM7 MCU FLASH 64K 100LQFP
Manufacturer
NXP Semiconductors
Series
LPC2300r
Datasheet

Specifications of LPC2361FBD100,551

Program Memory Type
FLASH
Program Memory Size
64KB (64K x 8)
Package / Case
100-LQFP
Core Processor
ARM7
Core Size
16/32-Bit
Speed
72MHz
Connectivity
CAN, I²C, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
70
Ram Size
34K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 6x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC23
Core
ARM7TDMI-S
Data Bus Width
16 bit, 32 bit
Data Ram Size
34 KB
Interface Type
CAN/I2S/SPI/SSP/USB
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
70
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
6-ch x 10-bit
On-chip Dac
1-ch x 10-bit
Package
100LQFP
Device Core
ARM7TDMI-S
Family Name
LPC2000
Maximum Speed
72 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
568-4310 - EVAL BOARD LPC2158 W/LCDMCB2360UME - BOARD EVAL MCB2360 + ULINK-MEMCB2360U - BOARD EVAL MCB2360 + ULINK2568-4014 - BOARD EVAL FOR LPC236X ARM568-3999 - BOARD EVAL FOR LPC23 ARM MCU
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4525
935286991551

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LPC2361FBD100,551
Quantity:
9 999
Part Number:
LPC2361FBD100,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
LPC2361_62_4
Product data sheet
13.3 XTAL and RTC Printed Circuit Board (PCB) layout guidelines
The crystal should be connected on the PCB as close as possible to the oscillator input
and output pins of the chip. Take care that the load capacitors C
case of third overtone crystal usage, have a common ground plane. The external
components must also be connected to the ground plain. Loops must be made as small
as possible, in order to keep the noise coupled in via the PCB as small as possible. Also
parasitics should stay as small as possible. Values of C
smaller accordingly to the increase in parasitics of the PCB layout.
Fig 20. Slave mode operation of the on-chip oscillator
Rev. 04 — 4 March 2010
XTAL1
LPC2xxx
C i
100 pF
002aae718
C g
x1
and C
Single-chip 16-bit/32-bit MCU
x2
x1
LPC2361/62
should be chosen
and C
© NXP B.V. 2010. All rights reserved.
x2
, and C
x3
50 of 57
in

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