LPC3250FET296,551 NXP Semiconductors, LPC3250FET296,551 Datasheet - Page 63
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LPC3250FET296,551
Manufacturer Part Number
LPC3250FET296,551
Description
IC ARM9 MCU 256K 296-TFBGA
Manufacturer
NXP Semiconductors
Series
LPC32x0r
Datasheet
1.OM11079.pdf
(77 pages)
Specifications of LPC3250FET296,551
Core Processor
ARM9
Core Size
16/32-Bit
Speed
266MHz
Connectivity
EBI/EMI, Ethernet, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
DMA, I²S, LCD, Motor Control PWM, PWM, WDT
Number Of I /o
51
Program Memory Type
ROMless
Ram Size
256K x 8
Voltage - Supply (vcc/vdd)
0.9 V ~ 3.6 V
Data Converters
A/D 3x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
296-TFBGA
Processor Series
LPC32
Core
ARM926EJ-S
Data Bus Width
32 bit
Data Ram Size
256 KB
Interface Type
I2C, I2S, UART, USB
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
51
Number Of Timers
6
Operating Supply Voltage
2.7 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, DK-57TS-LPC3250, DK-57VTS-LPC3250, SOMDIMM-LPC3250
Development Tools By Supplier
OM11016, OM11021, OM11045
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 8 Channel
For Use With
OM11021 - EVAL LPC-STICK WITH LPC3250OM11016 - KIT DEVELOPMENT LPC3250568-4743 - KIT LCD TOUCH 5.7" FOR LPC3250568-4742 - MODULE DIMM LPC2478 ARM7622-1030 - KIT LCD TOUCH 5.7" FOR LPC3250
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Lead Free Status / Rohs Status
Details
Other names
568-4533
935287084551
935287084551
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC3250FET296,551
Manufacturer:
BONENS
Quantity:
98
Company:
Part Number:
LPC3250FET296,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
Table 18.
T
LPC3220_30_40_50_1
Product data sheet
Symbol
t
t
t
ALS
ALH
AR
amb
=
−
40
Parameter
ALE set-up time
ALE hold time
ALE to RE delay time
°
Dynamic characteristics of SLC NAND flash memory controller
C to +85
11.8 SLC NAND flash memory controller
°
C.
Fig 15. MLC NAND flash controller write timing (writing to NAND flash)
Fig 16. MLC NAND flash controller read timing (reading from NAND flash)
FLASH_RDY (R/B)
FLASH_IO[7:0]
FLASH_IO[7:0]
FLASH_WR
All information provided in this document is subject to legal disclaimers.
FLASH_CE
FLASH_CE
FLASH_RD
Conditions
read
write
read
write
read
write
Rev. 01.03 — 16 March 2010
t
CELREL
[1][2][4][6]
[1][7]
[1][2][6]
t
WP
t
D0
WC
t
WH
D0
Min
-
-
-
-
-
-
D1
D1
LPC3220/30/40/50
Typ
T
T
T
T
T
T
HCLK
HCLK
HCLK
HCLK
HCLK
HCLK
Dn
t
16/32-bit ARM microcontrollers
RP
× (Rsu + Rw)
× (Wsu + Ww)
× Rh
× Wh
× Rsu
× Wsu
D2
t
RC
t
REH
10h
D3
t
WB
002aae443
© NXP B.V. 2010. All rights reserved.
002aae442
t
RHZ
Max Unit
-
-
-
-
-
-
63 of 77
ns
ns
ns
ns
ns
ns