LPC2138FHN64/01,55 NXP Semiconductors, LPC2138FHN64/01,55 Datasheet - Page 3
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LPC2138FHN64/01,55
Manufacturer Part Number
LPC2138FHN64/01,55
Description
IC ARM7 MCU FLASH 512K 64-HVQFN
Manufacturer
NXP Semiconductors
Series
LPC2100r
Specifications of LPC2138FHN64/01,55
Program Memory Type
FLASH
Program Memory Size
512KB (512K x 8)
Package / Case
64-VQFN Exposed Pad, 64-HVQFN, 64-SQFN, 64-DHVQFN
Core Processor
ARM7
Core Size
16/32-Bit
Speed
60MHz
Connectivity
I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
47
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC21
Core
ARM7TDMI-S
Data Bus Width
16 bit, 32 bit
Data Ram Size
32 KB
Interface Type
I2C/SPI/SSP/UART
Maximum Clock Frequency
60 MHz
Number Of Programmable I/os
47
Number Of Timers
2
Operating Supply Voltage
3 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, KSK-LPC2138, KSK-LPC2138-PL
Development Tools By Supplier
OM10045, OM10070, OM10089
Minimum Operating Temperature
- 40 C
On-chip Adc
2 (8-ch x 10-bit)
On-chip Dac
1-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
568-4310 - EVAL BOARD LPC2158 W/LCD568-4298 - BOARD EVAL LPC213X KS213X568-4297 - BOARD EVAL LPC21XX MCB2100MCB2130UME - BOARD EVAL MCB2130 + ULINK-MEMCB2130U - BOARD EVAL MCB2130 + ULINK2MCB2130 - BOARD EVAL NXP LPC213X ARM FAM622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K568-2095 - BOARD EVAL FOR LPC213X ARM MCU
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4011
935281779557
LPC2138FHN64/01
935281779557
LPC2138FHN64/01
NXP Semiconductors
LPC2131_32_34_36_38
Product data sheet
3.1 Ordering options
Table 1.
Table 2.
Type number
LPC2136FBD64
LPC2136FBD64/01 LQFP64
LPC2138FBD64
LPC2138FBD64/01 LQFP64
LPC2138FHN64
LPC2138FHN64/01 HVQFN64 plastic thermal enhanced very thin quad flat
Type number
LPC2131FBD64
LPC2131FBD64/01
LPC2132FBD64
LPC2132FBD64/01
LPC2132FHN64
LPC2132FHN64/01
LPC2134FBD64
LPC2134FBD64/01
LPC2136FBD64
LPC2136FBD64/01
LPC2138FBD64
LPC2138FBD64/01
LPC2138FHN64
LPC2138FHN64/01
Ordering information
Ordering options
All information provided in this document is subject to legal disclaimers.
Package
Name
LQFP64
LQFP64
HVQFN64 plastic thermal enhanced very thin quad flat
Flash
memory
32 kB
32 kB
64 kB
64 kB
64 kB
64 kB
128 kB
128 kB
256 kB
256 kB
512 kB
512 kB
512 kB
512 kB
Rev. 5 — 2 February 2011
RAM
8 kB
8 kB
16 kB 1
16 kB 1
16 kB 1
16 kB 1
16 kB 2
16 kB 2
32 kB 2
32 kB 2
32 kB 2
32 kB 2
32 kB 2
32 kB 2
Description
plastic low profile quad flat package; 64 leads;
body 10 × 10 × 1.4 mm
plastic low profile quad flat package; 64 leads;
body 10 × 10 × 1.4 mm
plastic low profile quad flat package; 64 leads;
body 10 × 10 × 1.4 mm
plastic low profile quad flat package; 64 leads;
body 10 × 10 × 1.4 mm
package; no leads; 64 terminals; body
9 × 9 × 0.85 mm
package; no leads; 64 terminals; body
9 × 9 × 0.85 mm
…continued
ADC
1
1
DAC
-
-
1
1
1
1
1
1
1
1
1
1
1
1
LPC2131/32/34/36/38
Single-chip 16/32-bit microcontrollers
Enhanced UARTs,
ADC, Fast I/Os, and
BOD
yes
yes
yes
yes
yes
yes
yes
no
no
no
no
no
no
no
© NXP B.V. 2011. All rights reserved.
Temperature
range
−40 °C to +85 °C
−40 °C to +85 °C
−40 °C to +85 °C
−40 °C to +85 °C
−40 °C to +85 °C
−40 °C to +85 °C
−40 °C to +85 °C
−40 °C to +85 °C
−40 °C to +85 °C
−40 °C to +85 °C
−40 °C to +85 °C
−40 °C to +85 °C
−40 °C to +85 °C
−40 °C to +85 °C
Version
SOT314-2
SOT314-2
SOT314-2
SOT314-2
SOT804-2
SOT804-2
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