PIC16F882-I/SP Microchip Technology, PIC16F882-I/SP Datasheet - Page 272

IC PIC MCU FLASH 2KX14 28DIP

PIC16F882-I/SP

Manufacturer Part Number
PIC16F882-I/SP
Description
IC PIC MCU FLASH 2KX14 28DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F882-I/SP

Program Memory Type
FLASH
Program Memory Size
3.5KB (2K x 14)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
24
Eeprom Size
128 x 8
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Interface Type
EUSART/MSSP
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
28
Number Of Timers
3
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM164120-3
Minimum Operating Temperature
- 40 C
On-chip Adc
11-ch x 10-bit
A/d Bit Size
10 bit
A/d Channels Available
11
Height
3.3 mm
Length
34.67 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
2 V
Width
7.24 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DVA18XP280 - DEVICE ADAPTER 18F2220 PDIP 28LD
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16F882-I/SP
Manufacturer:
IR
Quantity:
3 000
Part Number:
PIC16F882-I/SP
0
PIC16F882/883/884/886/887
44-Lead Plastic Quad Flat No Lead Package (ML) 8x8 mm Body (QFN)
DS41291C-page 270
Note:
A3
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
3. Package is saw singulated
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
TOP VIEW
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length §
Contact-to-Exposed Pad §
D
N
A1
Microchip Technology Drawing No. C04–103, Sept. 8, 2006
Dimension Limits
1
2
E
EXPOSED
Preliminary
A
NOTE 1
PAD
E2
Units
D2
A1
A3
E2
N
D
e
A
E
b
L
K
2
1
MIN
0.80
0.00
6.30
6.30
0.25
0.30
0.20
N
BOTTOM VIEW
MILLIMETERS
0.65 BSC
8.00 BSC
8.00 BSC
0.20 REF
NOM
0.90
0.02
6.45
6.45
0.30
0.40
D2
44
L
MAX
1.00
0.05
6.80
6.80
0.38
0.50
© 2006 Microchip Technology Inc.
e
b
K

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