LPC1113FHN33/301,5 NXP Semiconductors, LPC1113FHN33/301,5 Datasheet - Page 51
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LPC1113FHN33/301,5
Manufacturer Part Number
LPC1113FHN33/301,5
Description
IC MCU 32BIT 24KB FLASH 33HVQFN
Manufacturer
NXP Semiconductors
Series
LPC1100r
Datasheets
1.LPC1114FHN333015.pdf
(2 pages)
2.LPC1114FHN333015.pdf
(66 pages)
3.LPC1114FHN333015.pdf
(66 pages)
4.LPC1113FHN333015.pdf
(60 pages)
Specifications of LPC1113FHN33/301,5
Program Memory Type
FLASH
Program Memory Size
24KB (24K x 8)
Package / Case
33-VQFN Exposed Pad, 33-HVQFN, 33-SQFN, 33-DHVQFN
Core Processor
ARM Cortex-M0
Core Size
32-Bit
Speed
50MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, WDT
Number Of I /o
28
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC11
Core
ARM Cortex M0
Data Bus Width
32 bit
Data Ram Size
8 KB
Interface Type
I2C, SPI, UART
Number Of Programmable I/os
28
Operating Supply Voltage
1.8 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 8 Channel
Cpu Family
LPC1100
Device Core
ARM Cortex M0
Device Core Size
32b
Frequency (max)
50MHz
Total Internal Ram Size
8KB
# I/os (max)
42
Number Of Timers - General Purpose
4
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
1.8V
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
33
Package Type
HVQFN EP
Package
33HVQFN EP
Family Name
LPC1100
Maximum Speed
50 MHz
Number Of Timers
4
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4951
935290776551
935290776551
NXP Semiconductors
LPC1111_12_13_14
Product data sheet
11.4 Standard I/O pad configuration
order to keep the noise coupled in via the PCB as small as possible. Also parasitics
should stay as small as possible. Values of C
accordingly to the increase in parasitics of the PCB layout.
Figure 26
Fig 26. Standard I/O pad configuration
•
•
•
•
•
as digital output
as analog input
as digital input
pin configured
pin configured
pin configured
Digital output driver
Digital input: Pull-up enabled/disabled
Digital input: Pull-down enabled/disabled
Digital input: Repeater mode enabled/disabled
Analog input
driver
shows the possible pin modes for standard I/O pins with analog input function:
All information provided in this document is subject to legal disclaimers.
repeater mode
analog input
Rev. 2 — 18 August 2010
data input
enable
output
output enable
pull-down enable
pull-up enable
select analog input
x1
and C
32-bit ARM Cortex-M0 microcontroller
LPC1111/12/13/14
x2
should be chosen smaller
V
DD
weak
pull-up
weak
pull-down
© NXP B.V. 2010. All rights reserved.
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