MCIMX515CJM6C Freescale Semiconductor, MCIMX515CJM6C Datasheet - Page 171

• Manufacturer Part Number: MCIMX515CJM6C
• Description: MULTIMEDIA PROC 529-LFBGA
• Manufacturer: Freescale Semiconductor
• Series: i.MX51r

Specifications of MCIMX515CJM6C

• Core Processor: ARM Cortex-A8
• Core Size: 32-Bit
• Speed: 600MHz
• Connectivity: 1-Wire, EBI/EMI, Ethernet, I²C, IrDA, MMC, SPI, SSI, UART/USART, USB OTG
• Peripherals: DMA, I²S, LCD, POR, PWM, WDT
• Number Of I /o: 128
• Program Memory Type: ROMless
• Ram Size: 128K x 8
• Voltage - Supply (vcc/vdd): 0.8 V ~ 1.15 V
• Oscillator Type: External
• Operating Temperature: -20°C ~ 85°C
• Package / Case: 529-LFBGA
• Processor Series: i.MX51
• Core: ARM Cortex A8
• Data Bus Width: 32 bit
• Program Memory Size: 36 KB
• Data Ram Size: 128 KB
• Interface Type: I2C, SPI, SSI, UART, USB
• Maximum Clock Frequency: 200 MHz
• Number Of Timers: 5
• Operating Supply Voltage: 0.8 V to 1.15 V
• Maximum Operating Temperature: + 95 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: MCIMX51EVKJ
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

5.2.1.1
The following notes apply to
1
2
3
4
5
5.2.2
Table 130
assignments including associated power supplies.
5.2.2.1
Table 130
alpha-sorted by name.
Freescale Semiconductor
All dimensions in millimeters.
Dimensioning and tolerancing per ASME Y14.5M-1994.
Maximum solder ball diameter measured parallel to Datum A.
Datum A, the seating plane, is determined by the spherical crowns of the solder balls.
Parallelism measurement shall exclude any effect of mark on top surface of package.
NVCC_EMI_DRAM
GND_ANA_PLL_A
GND_ANA_PLL_B
GND_DIG_PLL_A
GND_DIG_PLL_B
NGND_TV_BACK
NGND_USBPHY
Contact Name
NVCC_HS4_1
NVCC_HS4_2
NVCC_HS10
AHVDDRGB
NGND_OSC
AHVSSRGB
NVCC_HS6
NVCC_EMI
NVCC_I2C
GND
shows the device connection list and
shows the device connection list for ground, power, sense, and reference contact signals
19 x 19 mm Signal Assignments, Power Rails, and I/O
Table 130. 19 x 19 mm Ground, Power, Sense, and Reference Contact Assignments
19 x 19 mm Package Drawing Notes
19 x 19 mm Ground, Power, Sense, and Reference Contact Assignments
i.MX51 Applications Processors for Consumer and Industrial Products, Rev. 4
Y18, AA18
Y19, AA19
A1 , A23, G5, H9, J8, J9, J10, J12, J13, J14, K8, K9, K10, K11, K12, K13, K14, L8, L9, L10, L11,L12,
L13, L14, M9, M10, M11, M12, M13, M14, M15, N8, N9, N10, N11, N12, N13, N14, N15, N16, P8,
P9, P10, P11, P12, P13, P14, P15, R8, R9, R10, R11,R12, R13, R14, R15, R16, T5, T16, AC1,
AC21, AC23
U7
U17
T7
V18
V17
T15
L16
U8, U9, U10, U11, U12, V7
H6, J6, K6, L6, M6, N6, P6, R6, T6
M16
M18
N18
M17
T14
Figure
109.
Table 131
Contact Assignment
displays an alpha-sorted list of the signal
Package Information and Contact Assignments
171