PIC16F688-I/STG Microchip Technology, PIC16F688-I/STG Datasheet - Page 189

• Manufacturer Part Number: PIC16F688-I/STG
• Description: IC PIC MCU FLASH 4KX14 14TSSOP
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F688-I/STG

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: UART/USART
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number Of I /o: 12
• Program Memory Size: 7KB (4K x 14)
• Program Memory Type: FLASH
• Eeprom Size: 256 x 8
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 14-TSSOP
• For Use With: XLT14SS-1 - SOCKET TRANSITION 14DIP/14SSOPAC162061 - HEADER INTRFC MPLAB ICD2 20PINAC162056 - HEADER INTERFACE ICD2 16F688
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

© 2009 Microchip Technology Inc.
14-Lead Plastic Small Outline (SL) – Narrow, 3.90 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
A
A1
1
N
2
b
3
D
Dimension Limits
e
Units
A2
A1
E1
L1
E1
D
N
A
E
α
e
h
L
φ
c
b
β
A2
E
MIN
1.25
0.10
0.25
0.40
0.17
0.31
φ
0°
5°
5°
–
L
MILLMETERS
h
8.65 BSC
1.27 BSC
6.00 BSC
3.90 BSC
1.04 REF
L1
NOM
14
–
–
–
–
–
–
–
–
–
–
Microchip Technology Drawing C04-065B
h
PIC16F688
β
MAX
1.75
0.25
0.50
1.27
0.25
0.51
15°
15°
8°
–
DS41203E-page 187
α
c