PIC18F27J13-I/ML Microchip Technology, PIC18F27J13-I/ML Datasheet - Page 426

IC PIC MCU 128KB FLASH 28QFN

PIC18F27J13-I/ML

Manufacturer Part Number
PIC18F27J13-I/ML
Description
IC PIC MCU 128KB FLASH 28QFN
Manufacturer
Microchip Technology
Series
PIC® XLP™ 18Fr

Specifications of PIC18F27J13-I/ML

Core Size
8-Bit
Program Memory Size
128KB (64K x 16)
Core Processor
PIC
Speed
48MHz
Connectivity
I²C, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Program Memory Type
FLASH
Ram Size
3.8K x 8
Voltage - Supply (vcc/vdd)
2.15 V ~ 3.6 V
Data Converters
A/D 10x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
*
Controller Family/series
PIC18
Cpu Speed
48MHz
Digital Ic Case Style
QFN
Supply Voltage Range
1.8V To 5.5V
Embedded Interface Type
I2C, SPI, USART
Rohs Compliant
Yes
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
4 KB
Interface Type
I2C, SPI, EUSART
Maximum Clock Frequency
48 MHz
Number Of Programmable I/os
19
Number Of Timers
8
Operating Supply Voltage
2 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
DM164128, DM180021, DM183026-2, DV164131, MA180030, DM183022, DM183032, DV164136, MA180024
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 10 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
MA180030 - BOARD DEMO PIC18F47J13 FS USBMA180029 - BOARD DEMO PIC18F47J53 FS USB
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18F27J13-I/ML
Manufacturer:
MICROCHIP
Quantity:
4 000
PIC18(L)F2X/4XK22
27.2
DS41412D-page 426
D017
D018
Note 1:
Param
PIC18LF2X/4XK22
PIC18F2X/4XK22
No.
2:
3:
DC Characteristics: Power-Down Current, PIC18(L)F2X/4XK22 (Continued)
DAC
FVR
Device Characteristics
The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is
measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to V
and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
BOR, HLVD and FVR enable internal band gap reference. With both modules enabled, current consump-
tion will be less than the sum of both specifications.
A/D converter differential currents apply only in Run mode. In Sleep or Idle mode both the ADC and the
FRC turn off as soon as conversion (if any) is complete.
Standard Operating Conditions (unless otherwise stated)
Operating temperature
Standard Operating Conditions (unless otherwise stated)
Operating temperature
+25°C
Typ
12
20
12
20
33
15
15
30
35
70
+60°C
Typ
Preliminary
+85°C
Max
100
20
30
20
30
50
25
25
45
55
+125°C
-40°C  T
-40°C  T
Max
100
20
30
20
30
50
25
25
45
55
A
A
Units
A
A
A
A
A
A
A
A
A
A
 +125°C
 +125°C
1.8V
3.0V
1.8V
3.0V
5.0V
1.8V
3.0V
1.8V
3.0V
5.0V
V
DD
 2010 Microchip Technology Inc.
Conditions
Notes
DD
or V
SS

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