DSPIC30F4012-30I/SP Microchip Technology, DSPIC30F4012-30I/SP Datasheet - Page 213
DSPIC30F4012-30I/SP
Manufacturer Part Number
DSPIC30F4012-30I/SP
Description
IC DSPIC MCU/DSP 48K 28DIP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F4012-30ISO.pdf
(238 pages)
2.DSPIC30F4012-30ISO.pdf
(18 pages)
3.DSPIC30F4012-30ISO.pdf
(6 pages)
4.DSPIC30F4012-30ISO.pdf
(16 pages)
5.DSPIC30F4012-30ISO.pdf
(22 pages)
6.DSPIC30F4011-30IP.pdf
(228 pages)
Specifications of DSPIC30F4012-30I/SP
Program Memory Type
FLASH
Program Memory Size
48KB (16K x 24)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
dsPIC
Core Size
16-Bit
Speed
30 MIPs
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
20
Eeprom Size
1K x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 6x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC30F
Core
dsPIC
Maximum Clock Frequency
30 MHz
Number Of Programmable I/os
20
Data Ram Size
2 KB
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM300027, DM330011, DM300018, DM183021
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
DSPIC30F401230ISP
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC30F4012-30I/SP
Manufacturer:
TI
Quantity:
17 600
Part Number:
DSPIC30F4012-30I/SP
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
- DSPIC30F4012-30ISO PDF datasheet
- DSPIC30F4012-30ISO PDF datasheet #2
- DSPIC30F4012-30ISO PDF datasheet #3
- DSPIC30F4012-30ISO PDF datasheet #4
- DSPIC30F4012-30ISO PDF datasheet #5
- DSPIC30F4011-30IP PDF datasheet #6
- Current page: 213 of 228
- Download datasheet (7Mb)
25.2
28-Lead Skinny Plastic Dual In-line (SP) – 300 mil Body (PDIP)
2005 Microchip Technology Inc.
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-095
Drawing No. C04-070
Package Details
n
β
eB
E1
E
2
1
Dimension Limits
c
D
§
A1
A
Units
eB
A2
A1
E1
B1
D
p
A
E
L
B
α
β
n
c
MIN
1.345
Preliminary
.140
.125
.015
.300
.275
.125
.008
.040
.016
.320
5
5
B
B1
INCHES*
NOM
28
1.365
.285
.100
.150
.130
.310
.130
.012
.053
.019
.350
10
10
dsPIC30F4011/4012
MAX
1.385
.160
.135
.325
.295
.135
.015
.065
.022
.430
15
15
MIN
34.16
3.56
3.18
0.38
7.62
6.99
3.18
0.20
1.02
8.13
0.41
5
5
MILLIMETERS
p
α
NOM
28
34.67
2.54
3.30
7.87
7.24
3.30
0.29
1.33
0.48
8.89
3.81
10
10
DS70135C-page 211
A2
L
MAX
35.18
10.92
4.06
3.43
8.26
7.49
3.43
0.38
1.65
0.56
15
15
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