DSPIC30F4012-30I/SP Microchip Technology, DSPIC30F4012-30I/SP Datasheet - Page 214

IC DSPIC MCU/DSP 48K 28DIP

DSPIC30F4012-30I/SP

Manufacturer Part Number
DSPIC30F4012-30I/SP
Description
IC DSPIC MCU/DSP 48K 28DIP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr

Specifications of DSPIC30F4012-30I/SP

Program Memory Type
FLASH
Program Memory Size
48KB (16K x 24)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
dsPIC
Core Size
16-Bit
Speed
30 MIPs
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
20
Eeprom Size
1K x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 6x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC30F
Core
dsPIC
Maximum Clock Frequency
30 MHz
Number Of Programmable I/os
20
Data Ram Size
2 KB
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM300027, DM330011, DM300018, DM183021
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
DSPIC30F401230ISP

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC30F4012-30I/SP
Manufacturer:
TI
Quantity:
17 600
Part Number:
DSPIC30F4012-30I/SP
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
dsPIC30F4011/4012
28-Lead Plastic Small Outline (SO) – Wide, 300 mil Body (SOIC)
DS70135C-page 212
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-013
Drawing No. C04-052
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle Top
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B
c
p
n
45°
β
E1
E
Dimension Limits
h
Units
A2
A1
E1
E
D
B
n
p
A
h
L
c
α
φ
β
2
1
D
L
MIN
Preliminary
φ
.093
.088
.004
.394
.288
.695
.010
.016
.009
.014
0
0
0
A1
INCHES*
A
NOM
28
.050
.099
.008
.407
.295
.704
.020
.033
.017
.091
.011
12
12
4
MAX
.104
.094
.012
.420
.299
.712
.029
.050
.013
.020
15
15
8
MIN
17.65
10.01
0.25
2.36
2.24
0.10
7.32
0.23
0.36
0.41
0
0
0
MILLIMETERS
 2005 Microchip Technology Inc.
NOM
28
10.34
17.87
1.27
2.50
0.20
7.49
0.50
0.84
0.28
0.42
2.31
12
12
4
α
MAX
A2
10.67
18.08
2.64
2.39
0.30
7.59
0.74
1.27
0.33
0.51
15
15
8

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