DSPIC30F5016-20E/PT Microchip Technology, DSPIC30F5016-20E/PT Datasheet - Page 216
![no-image](/images/manufacturer_photos/0/4/439/microchip_technology_sml.jpg)
DSPIC30F5016-20E/PT
Manufacturer Part Number
DSPIC30F5016-20E/PT
Description
IC DSPIC MCU/DSP 66K 80TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F2011-20ISO.pdf
(66 pages)
2.DSPIC30F2011-20IP.pdf
(26 pages)
3.DSPIC30F5016-30IPT.pdf
(230 pages)
4.DSPIC30F5016-30IPT.pdf
(14 pages)
5.DSPIC30F5016-30IPT.pdf
(6 pages)
6.DSPIC30F5016-30IPT.pdf
(18 pages)
Specifications of DSPIC30F5016-20E/PT
Core Processor
dsPIC
Core Size
16-Bit
Speed
20 MIPS
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
68
Program Memory Size
66KB (22K x 24)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
80-TFQFP
For Use With
AC164320 - MODULE SKT MPLAB PM3 80TQFPAC30F007 - MODULE SKT FOR DSPIC30F 80TQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC30F5016-20E/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
- DSPIC30F2011-20ISO PDF datasheet
- DSPIC30F2011-20IP PDF datasheet #2
- DSPIC30F5016-30IPT PDF datasheet #3
- DSPIC30F5016-30IPT PDF datasheet #4
- DSPIC30F5016-30IPT PDF datasheet #5
- DSPIC30F5016-30IPT PDF datasheet #6
- Current page: 216 of 230
- Download datasheet (4Mb)
dsPIC30F5015/5016
64-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm Footprint [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
DS70149D-page 216
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
e
b
c
Number of Leads
Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
β
N
1 2 3
D
D1
L
Dimension Limits
E1
NOTE 2
φ
Units
A2
A1
E1
D1
L1
N
A
E
D
α
e
L
φ
c
b
β
E
A1
A
MIN
0.95
0.05
0.45
0.09
0.17
11°
11°
0°
–
MILLIMETERS
12.00 BSC
12.00 BSC
10.00 BSC
10.00 BSC
0.50 BSC
1.00 REF
L1
NOM
1.00
0.60
0.22
3.5°
12°
12°
64
–
–
–
Microchip Technology Drawing C04-085B
© 2008 Microchip Technology Inc.
MAX
1.20
1.05
0.15
0.75
0.20
0.27
13°
13°
7°
α
A2
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