PIC18F2685-E/SO Microchip Technology, PIC18F2685-E/SO Datasheet - Page 460

• Manufacturer Part Number: PIC18F2685-E/SO
• Description: IC PIC MCU FLASH 48KX16 28SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F2685-E/SO

• Core Size: 8-Bit
• Program Memory Size: 96KB (48K x 16)
• Oscillator Type: Internal
• Core Processor: PIC
• Speed: 40MHz
• Connectivity: CAN, I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number Of I /o: 25
• Program Memory Type: FLASH
• Eeprom Size: 1K x 8
• Ram Size: 3.25K x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 28-SOIC (7.5mm Width)
• Controller Family/series: PIC18
• No. Of I/o's: 28
• Eeprom Memory Size: 1024Byte
• Ram Memory Size: 3328Byte
• Cpu Speed: 40MHz
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 3.25 KB
• Interface Type: EUSART, I2C, MSSP, SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 28
• Number Of Timers: 4
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DV164136
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 8 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

PIC18F2682/2685/4682/4685
DS39761C-page 460
28-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOTE 1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A
A1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle Top
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
N
1 2 3
b
D
Dimension Limits
e
A2
Units
E1
A2
A1
E1
L1
N
D
A
E
α
e
h
L
φ
c
b
β
α
E
2.05
0.10
0.25
0.40
0.18
0.31
MIN
φ
0°
5°
5°
–
L1
L
MILLMETERS
10.30 BSC
17.90 BSC
1.27 BSC
7.50 BSC
1.40 REF
h
NOM
28
–
–
–
–
–
–
–
–
–
–
Microchip Technology Drawing C04-052B
h
© 2009 Microchip Technology Inc.
MAX
2.65
0.30
0.75
1.27
0.33
0.51
15°
15°
8°
β
–
c