STM8S103F3U6TR STMicroelectronics, STM8S103F3U6TR Datasheet - Page 100
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STM8S103F3U6TR
Manufacturer Part Number
STM8S103F3U6TR
Description
MCU 8BIT 8KB FLASH 20-UFQFPN
Manufacturer
STMicroelectronics
Series
STM8Sr
Datasheet
1.STM8S103F2P6TR.pdf
(113 pages)
Specifications of STM8S103F3U6TR
Core Processor
STM8
Core Size
8-Bit
Speed
16MHz
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
16
Program Memory Size
8KB (8K x 8)
Program Memory Type
FLASH
Eeprom Size
640 x 8
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
2.95 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
20-VFQFN, 20-VFQFPN
Processor Series
STM8S10x
Core
STM8
3rd Party Development Tools
EWSTM8
Development Tools By Supplier
STM8/128-MCKIT, STM8S-DISCOVERY, ST-LINK, STICE-SYS001, STX-RLINK
For Use With
497-10593 - KIT STARTER FOR STM8S207/8 SER
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
STM8S103F3U6TR
Manufacturer:
MAXIM
Quantity:
1 400
Company:
Part Number:
STM8S103F3U6TR
Manufacturer:
STMicroelectronics
Quantity:
10 000
Thermal characteristics
12
100/113
Thermal characteristics
The maximum chip junction temperature (T
Operating
The maximum chip-junction temperature, T
the following equation:
T
Where:
•
•
•
•
•
Symbol
Θ
Θ
Θ
Θ
Θ
(1)
convection environment.
Jmax
JA
JA
JA
JA
JA
Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural
T
Θ
P
P
power.
P
Where: P
V
Amax
Dmax
INTmax
I/Omax
OH
JA
= T
/I
is the package junction-to-ambient thermal resistance in °C/W
OH
Amax
is the maximum ambient temperature in °C
is the sum of P
conditions.
represents the maximum power dissipation on output pins
is the product of I
of the I/Os at low and high level in the application.
I/Omax
+ (P
Parameter
Thermal resistance junction-ambient
TSSOP20 - 4.4 mm
Thermal resistance junction-ambient
SO20W (300 mils)
Thermal resistance junction-ambient
UFQFPN20 - 3 x 3 mm
Thermal resistance junction-ambient
LQFP32 - 7 x 7 mm
Thermal resistance junction-ambient
UFQFPN32 - 5 x 5 mm
=Σ (V
Dmax
x Θ
OL
INTmax
*I
(1)
JA
DD
OL
Table 57: Thermal characteristics
)
) + Σ((V
andV
DocID15441 Rev 6
and P
DD
I/Omax
DD
, expressed in Watts. This is the maximum chip internal
-V
OH
Jmax
J max
(PDmax = P
)*I
, in degrees Celsius, may be calculated using
OH
) must never exceed the values given in
STM8S103K3 STM8S103F3 STM8S103F2
), taking into account the actual V
INTmax
+ P
Value
I/Omax
84
91
90
60
38
)
Unit
OL
°C/W
°C/W
°C/W
°C/W
°C/W
/I
OL and