STM32F103ZDH6 STMicroelectronics, STM32F103ZDH6 Datasheet - Page 115

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STM32F103ZDH6

Manufacturer Part Number
STM32F103ZDH6
Description
MCU ARM 32BIT 384KB FLASH 144BGA
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet

Specifications of STM32F103ZDH6

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
72MHz
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
Peripherals
DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
112
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 21x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-BGA
Processor Series
STM32F103x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
64 KB
Interface Type
CAN, I2C, SPI, USART
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
112
Number Of Timers
8
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
3 (12 bit, 16 Channel)
On-chip Dac
2 (12 bit, 2 Channel)
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STM32 Cortex-M3 Companion Products
Eeprom Size
-
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Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

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STM32F103xC, STM32F103xD, STM32F103xE
6.2.2
Selecting the product temperature range
When ordering the microcontroller, the temperature range is specified in the ordering
information scheme shown in
Each temperature range suffix corresponds to a specific guaranteed ambient temperature at
maximum dissipation and, to a specific maximum junction temperature.
As applications do not commonly use the STM32F103xC, STM32F103xD and
STM32F103xE at maximum dissipation, it is useful to calculate the exact power
consumption and junction temperature to determine which temperature range will be best
suited to the application.
The following examples show how to calculate the temperature range needed for a given
application.
Example 1: High-performance application
Assuming the following application conditions:
Thus: P
Using the values obtained in
This is within the range of the suffix 6 version parts (–40 < T
In this case, parts must be ordered at least with the temperature range suffix 6 (see
Table 71: Ordering information
Example 2: High-temperature application
Using the same rules, it is possible to address applications that run at high ambient
temperatures with a low dissipation, as long as junction temperature T
specified range.
Assuming the following application conditions:
Thus: P
Maximum ambient temperature T
I
level with I
at low level with I
P
P
This gives: P
P
T
Maximum ambient temperature T
I
level with I
P
P
This gives: P
P
DDmax
DDmax
Jmax
INTmax
IOmax
Dmax
INTmax
IOmax
Dmax
Dmax
Dmax
For LQFP100, 46 °C/W
= 82 °C + (46 °C/W × 447 mW) = 82 °C + 20.6 °C = 102.6 °C
= 175 + 272 = 447 mW
= 70 + 64 = 134 mW
= 50 mA, V
= 20 mA, V
= 20 × 8 mA × 0.4 V + 8 × 20 mA × 1.3 V = 272 mW
= 20 × 8 mA × 0.4 V = 64 mW
= 447 mW
= 134 mW
= 50 mA × 3.5 V= 175 mW
= 20 mA × 3.5 V= 70 mW
OL
OL
INTmax
INTmax
= 8 mA, V
= 8 mA, V
OL
DD
DD
= 175 mW and P
= 70 mW and P
= 20 mA, V
= 3.5 V, maximum 20 I/Os used at the same time in output at low
= 3.5 V, maximum 20 I/Os used at the same time in output at low
OL
OL
Table 70
Table 71: Ordering information
Doc ID 14611 Rev 7
= 0.4 V and maximum 8 I/Os used at the same time in output
= 0.4 V
scheme).
OL
Amax
Amax
T
= 1.3 V
Jmax
IOmax
IOmax
= 82 °C (measured according to JESD51-2),
= 115 °C (measured according to JESD51-2),
is calculated as follows:
= 64 mW:
= 272 mW:
J
scheme.
< 105 °C).
Package characteristics
J
remains within the
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