CY8CLED16P01-28PVXIT Cypress Semiconductor Corp, CY8CLED16P01-28PVXIT Datasheet - Page 41

IC PLC PSOC CMOS LED 16CH 28SSOP

CY8CLED16P01-28PVXIT

Manufacturer Part Number
CY8CLED16P01-28PVXIT
Description
IC PLC PSOC CMOS LED 16CH 28SSOP
Manufacturer
Cypress Semiconductor Corp
Series
PowerPSoC® CY8CLEDr
Datasheet

Specifications of CY8CLED16P01-28PVXIT

Package / Case
28-SSOP
Core Processor
M8C
Core Size
8-Bit
Speed
24MHz
Connectivity
I²C, IrDA, SPI, UART/USART
Peripherals
LED, PLC, POR, PWM, WDT
Number Of I /o
24
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
4.75 V ~ 5.25 V
Data Converters
A/D 4x14b; D/A 4x9b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Operating Supply Voltage
4.75 V to 5.25 V
Maximum Supply Current
8 mA
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details
11.1 Thermal Impedances
Table 11-1. Thermal Impedances per Package
11.2 Capacitance on Crystal Pins
Table 11-2. Typical Package Capacitance on Crystal Pins
11.3 Solder Reflow Peak Temperature
Following is the minimum solder reflow peak temperature to achieve good solderability.
Table 11-3. Solder Reflow Peak Temperature
Notes
Document Number: 001-49263 Rev. *E
11. T
12. To achieve the thermal impedance specified for the QFN package, the center thermal pad should be soldered to the PCB ground plane.
13. Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5°C with Sn-Pb or 245 ± 5°C with Sn-Ag-Cu
paste. Refer to the solder manufacturer specifications.
J
= T
A
+ POWER ×
48 QFN
100 TQFP
100 TQFP
28 SSOP
28 SSOP
Package
Package
48 QFN
100 TQFP
28 SSOP
Package
48 QFN
[12]
θ
JA
Package Capacitance
Typical θ
94°C/W
28°C/W
50°C/W
2.8 pF
1.8 pF
3.1 pF
Minimum Peak Temperature
JA
[11]
240°C
220°C
220°C
[13]
Maximum Peak Temperature
CY8CLED16P01
260°C
260°C
260°C
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