STR910FAZ32H6 STMicroelectronics, STR910FAZ32H6 Datasheet - Page 101

• Manufacturer Part Number: STR910FAZ32H6
• Description: MCU 256KB FLASH 64K RAM 144LFBGA
• Manufacturer: STMicroelectronics
• Series: STR9r

Specifications of STR910FAZ32H6

• Core Processor: ARM9
• Core Size: 32-Bit
• Speed: 96MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number Of I /o: 80
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 1.65 V ~ 2 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LFBGA
• Processor Series: STR910x
• Core: ARM966E-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 64 KB
• Interface Type: CAN, I2C, IrDA, SSP, UART
• Maximum Clock Frequency: 96 MHz
• Number Of Programmable I/os: 80
• Number Of Timers: 4
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWARM, EWARM-BL, MCBSTR9, MCBSTR9U, MCBSTR9UME, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: STR9-COMSTICK, STR910-EVAL, STR91X-SK/HIT, STR91X-SK/IAR, STR91X-SK/KEI, STR91X-SK/RAI, STR9-DK/RAIS, STR91X-DK/IAR, STX-PRO/RAIS, STR912-D/RAIS, STR79-RVDK/CPP, STR79-RVDKCPP/9, STR79-RVDK, STR79-RVDK/9, STR9-RVDK/BAS, STR79-RVDK/UPG
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 8 Channel
• For Use With: 497-8268 - BOARD EVAL FOR EVAL-STR910MCBSTR9UME - BOARD EVAL MCBSTR9 + ULINK-MEMCBSTR9U - BOARD EVAL MCBSTR9 + ULINK2MCBSTR9 - BOARD EVAL STM STR9 SERIES497-5067 - BOARD EVAL FOR STR910 FAMILY497-5066 - KIT STARTER KEIL FOR STR910497-5065 - KIT STARTER IAR KICKSTART STR912497-5064 - KIT STARTER FOR STR910 FAMILY497-5046 - KIT TOOL FOR ST7/UPSD/STR7 MCU
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details
• Other names: 497-6277

STR91xFAxxx
11
Revision history
Table 55.
09-May-2007
14-May-2008
26-Nov-2007
22-Dec-2008
17-Jul-2008
02-Jul-2009
Date
Document revision history
Revision
1
2
3
4
5
6
Doc ID 13495 Rev 6
Initial release
Updated Standby current in
characteristics on page 64
Added
Added
Updated
Added
Added
Added min/max values for E, D, E1, D1 in
Added 1MB and 2M devices, creating merged datasheet from
seperate STR91xFAx32, 42, 44, 46 and 47 devices.
Added STR912FAW32 to
Added paragraph on voltage supply shutdown in
page 24
Removed DMA feature for I2C in
Updated Sleep mode current in
on page 60
Added
Updated operating conditions for V
on page 61
Changed SPI master t
page 88
Updated
Updated
Updated I
page 64
Updated
Updated
Updated
Section 3.13.7: Tamper
“Normally Closed/Tamper Open mode”.
Table 31: I/O
Section 7.1: Parameter conditions on page 58
Section 7.7.2: X1_CPU external clock source on page 67
Figure 14: LVD reset delay case 3 on page 63
Table 48
Table 16: Typical current consumption at 25 °C on page 65
Section 7.11: External memory bus timings on page 76
Section 3.10.6 on page 22
Table 11: Operating conditions on page 61
Table 17: Internal clock frequencies on page 66
Table 31: I/O characteristics on page 75
Section 7.7.3 on page
SLEEP(IDDQ)
and
characteristics: Updated V
and
Section 7.7 on page 66
Table 49
in
SU
detection: Removed information about
Table 15: Supply current characteristics on
and t
Table 1: Device summary on page 1
Table 15: Supply current
Changes
in ADC characteristics section
H to
68. Small text changes.
Table 10: Current characteristics
Section 3.21 on page 33
TBD in
DD
and f
HYS
Section Table 46. on
Figure 41 on page 96
CPUCLK
row.
Revision history
Section 3.12 on
in
Section 7.3
101/102