M38227ECFP Renesas Electronics America, M38227ECFP Datasheet - Page 12

• Manufacturer Part Number: M38227ECFP
• Description: IC 740 MCU EPROM 48K 80QFP
• Manufacturer: Renesas Electronics America
• Series: 740/38000r

Specifications of M38227ECFP

• Core Processor: 740
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SIO, UART/USART
• Peripherals: LCD
• Number Of I /o: 49
• Program Memory Size: 48KB (48K x 8)
• Program Memory Type: OTP
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 8x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 85°C
• Package / Case: 80-QFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

GROUP EXPANSION (M VERSION)
Mitsubishi plans to expand the 3822 group (M version) as follows:
Memory Type
Support for Mask ROM version.
Memory Size
ROM size ........................................................... 16 K to 24 K bytes
RAM size .............................................................. 512 to 640 bytes
Fig. 7 Memory expansion plan for M version
Currently products are listed below.
Table 5 List of products for M version
M38223M4MXXXFP
M38223M4MXXXGP
M38223M4MXXXHP
M38224M6MXXXFP
M38224M6MXXXHP
Memory Expansion Plan
Product
R O M s i z e ( b y t e s )
3 2 K
2 8 K
2 4 K
2 0 K
1 6 K
1 2 K
4 8 K
ROM size for User in (
8 K
4 K
ROM size (bytes)
(16254)
(24446)
16384
24576
1 9 2
)
2 5 6
RAM size (bytes)
M a s s p r o d u c t
512
640
3 8 4
M a s s p r o d u c t
R A M s i z e ( b y t e s )
M 3 8 2 2 3 M 4 M
5 1 2
Package
80P6N-A .................................... 0.8 mm-pitch plastic molded QFP
80P6S-A .................................. 0.65 mm-pitch plastic molded QFP
80P6Q-A .................................... 0.5 mm-pitch plastic molded QFP
Package
80P6Q-A
80P6Q-A
80P6N-A
80P6S-A
80P6N-A
M 3 8 2 2 4 M 6 M
6 4 0
SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER
Mask ROM version
Mask ROM version
Mask ROM version
Mask ROM version
Mask ROM version
7 6 8
MITSUBISHI MICROCOMPUTERS
8 9 6
Remarks
1 0 2 4
3822 Group
As of Feb. 2002
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