D12363VF33V Renesas Electronics America, D12363VF33V Datasheet - Page 778

IC H8S/2363 MCU ROMLESS 128QFP

D12363VF33V

Manufacturer Part Number
D12363VF33V
Description
IC H8S/2363 MCU ROMLESS 128QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of D12363VF33V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
84
Program Memory Type
ROMless
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 10x10b, D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
128-QFP
For Use With
YR0K42378FC000BA - KIT EVAL FOR H8S/2378
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-

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Section 20 Flash Memory (0.18-μm F-ZTAT Version)
• Three on-board programming modes and one off-board programming mode
⎯ Boot mode
• One off-board programming mode
• Protection modes
Rev.6.00 Mar. 18, 2009 Page 718 of 980
REJ09B0050-0600
⎯ User program mode
⎯ User boot mode
⎯ PROM mode
There are two protection modes: software protection by the register setting and hardware
protection by the FWE pin. The protection state for flash memory programming/erasing can be
set.
This mode is a program mode that uses an on-chip SCI interface. The user MAT and user
boot MAT can be programmed. This mode can automatically adjust the bit rate between
host and this LSI.
The user MAT can be programmed by using the optional interface.
The user boot program of the optional interface can be made and the user MAT can be
programmed.
This mode uses the PROM programmer. The user MAT and user boot MAT can be
programmed.

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