DF2378RVFQ34V Renesas Electronics America, DF2378RVFQ34V Datasheet - Page 66

• Manufacturer Part Number: DF2378RVFQ34V
• Description: IC H8S MCU FLASH 512K 144LQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of DF2378RVFQ34V

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 34MHz
• Connectivity: I²C, IrDA, SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 97
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 16x10b; D/A 6x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-LQFP
• For Use With: YLCDRSK2378 - KIT DEV EVAL H8S/2378 LCDYR0K42378FC000BA - KIT EVAL FOR H8S/2378HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)EDK2378 - DEV EVAL KIT FOR H8S/2378
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Table 21.8 (2) Useable Area for Erasure in User Program Mode................................................. 914
Table 21.8 (3) Useable Area for Programming in User Boot Mode ............................................. 916
Table 21.8 (4) Useable Area for Erasure in User Boot Mode....................................................... 918
Table 21.9
Table 21.10 Software Protection ................................................................................................. 921
Table 21.11 Inquiry and Selection Commands ........................................................................... 928
Table 21.12 Programming/Erasing Command ............................................................................ 941
Table 21.13 Status Code.............................................................................................................. 950
Table 21.14 Error Code............................................................................................................... 951
Table 21.15 User Branch Processing Start Intervals ................................................................... 952
Section 23 Clock Pulse Generator ..................................................................... 955
Table 23.1
Table 23.2
Table 23.3
Section 24 Power-Down Modes ........................................................................ 965
Table 24.1
Table 24.2
Table 24.3
Section 26 Electrical Characteristics ............................................................... 1019
Table 26.1
Table 26.2
Table 26.3
Table 26.4
Table 26.5
Table 26.6
Table 26.7
Table 26.8
Table 26.9
Table 26.10 Timing of On-Chip Peripheral Modules................................................................ 1030
Table 26.11 A/D Conversion Characteristics ............................................................................ 1032
Table 26.12 D/A Conversion Characteristics ............................................................................ 1032
Table 26.13 Flash Memory Characteristics (0.35-μm F-ZTAT Version) ................................. 1033
Table 26.14 Absolute Maximum Ratings.................................................................................. 1035
Table 26.15 DC Characteristics................................................................................................. 1036
Table 26.16 DC Characteristics................................................................................................. 1037
Table 26.17 Permissible Output Currents ................................................................................. 1038
Table 26.18 Clock Timing......................................................................................................... 1039
Table 26.19 Control Signal Timing........................................................................................... 1040
Rev.7.00 Mar. 18, 2009 page lxiv of lxvi
REJ09B0109-0700
Hardware Protection................................................................................................ 920
Damping Resistance Value ..................................................................................... 958
Crystal Resonator Characteristics............................................................................ 959
External Clock Input Conditions ............................................................................. 960
Operating Modes and Internal states of the LSI ...................................................... 966
Oscillation Stabilization Time Settings ................................................................... 975
φ Pin State in Each Processing State ....................................................................... 979
Absolute Maximum Ratings.................................................................................. 1019
DC Characteristics (1) ........................................................................................... 1020
DC Characteristics (2) ........................................................................................... 1021
Permissible Output Currents ................................................................................. 1022
Clock Timing......................................................................................................... 1024
Control Signal Timing........................................................................................... 1025
Bus Timing (1) ...................................................................................................... 1026
Bus Timing (2) ...................................................................................................... 1027
DMAC and EXDMAC Timing ............................................................................. 1029