MMC2107CFCAG33 Freescale Semiconductor, MMC2107CFCAG33 Datasheet - Page 101
![IC MCU 33MHZ 128K FLASH 144-LQFP](/photos/12/42/124277/mmc2107cfcag33_sml.jpg)
MMC2107CFCAG33
Manufacturer Part Number
MMC2107CFCAG33
Description
IC MCU 33MHZ 128K FLASH 144-LQFP
Manufacturer
Freescale Semiconductor
Series
MCorer
Datasheet
1.MMC2107CFCAF33.pdf
(618 pages)
Specifications of MMC2107CFCAG33
Core Processor
M210
Core Size
32-Bit
Speed
33MHz
Connectivity
EBI/EMI, SCI, SPI
Peripherals
POR, PWM, WDT
Number Of I /o
72
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Processor Series
MMC2107
Core
M-CORE
Data Bus Width
32 bit
Data Ram Size
8 KB
Interface Type
SCI/SPI
Maximum Clock Frequency
33 MHz
Number Of Programmable I/os
72
Number Of Timers
2
Operating Supply Voltage
0 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
Cpu Family
Mcore
Device Core
MCORE
Device Core Size
32b
Frequency (max)
33MHz
Total Internal Ram Size
8KB
# I/os (max)
72
Number Of Timers - General Purpose
2
Operating Supply Voltage (typ)
3.3/5V
Operating Supply Voltage (max)
3.6/5.5V
Operating Supply Voltage (min)
2.7/4.5V
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
144
Package Type
LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MMC2107CFCAG33
Manufacturer:
FREESCALE
Quantity:
210
Company:
Part Number:
MMC2107CFCAG33
Manufacturer:
freescaie
Quantity:
35
Company:
Part Number:
MMC2107CFCAG33
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
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3.8.1 Reset Configuration
MMC2107 – Rev. 2.0
MOTOROLA
During reset, the pins for the reset override functions are immediately
configured to known states, even if the clock source is not present.
Table 3-6
If the RCON pin is not asserted during reset, the chip configuration and
the reset configuration pin functions after reset are determined by RCON
or fixed defaults, regardless of the states of the external data pins. The
internal configuration signals are driven to levels specified by the RCON
register’s reset state for default module configuration.
If the external RCON pin is asserted during reset, then various chip
functions, including the reset configuration pin functions after reset, are
configured according to the levels driven onto the external data pins.
(See
the levels on the external configuration pins to allow for module
configuration.
D[28, 26, 23:21, 19:16],
PA[4, 2], PB[7:5, 3:0]
RCON
V
1. If the external RCON pin is not asserted during reset, pin functions are determined by the
2. During reset, the external RCON pin assumes its RCON pin function, but this pin changes
DDSYN
Freescale Semiconductor, Inc.
default operation mode defined in the RCON register. If the external RCON pin is asserted,
pin functions are determined by the chip operation mode defined by the override values
driven on the external data bus pins.
to the function defined by the chip operation mode immediately after reset. See
For More Information On This Product,
Table
Table 3-6. Reset Configuration Pin States During Reset
Chip Configuration Module (CCM)
Pin
shows the states of the external pins while in reset.
3-7.) The internal configuration signals are driven to reflect
Go to: www.freescale.com
Digital I/O or primary
function
RCON function for all
modes
Not affected
Function
(2)
Pin
(1)
Chip Configuration Module (CCM)
Input
Input
Input
I/O
Output
State
—
—
—
Functional Description
Must be driven
by external logic
Internal weak
pullup device
Must be driven by
external logic
Technical Data
Input
State
Table
3-7.
101
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