MMC2107CFCAG33 Freescale Semiconductor, MMC2107CFCAG33 Datasheet - Page 597
![IC MCU 33MHZ 128K FLASH 144-LQFP](/photos/12/42/124277/mmc2107cfcag33_sml.jpg)
MMC2107CFCAG33
Manufacturer Part Number
MMC2107CFCAG33
Description
IC MCU 33MHZ 128K FLASH 144-LQFP
Manufacturer
Freescale Semiconductor
Series
MCorer
Datasheet
1.MMC2107CFCAF33.pdf
(618 pages)
Specifications of MMC2107CFCAG33
Core Processor
M210
Core Size
32-Bit
Speed
33MHz
Connectivity
EBI/EMI, SCI, SPI
Peripherals
POR, PWM, WDT
Number Of I /o
72
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Processor Series
MMC2107
Core
M-CORE
Data Bus Width
32 bit
Data Ram Size
8 KB
Interface Type
SCI/SPI
Maximum Clock Frequency
33 MHz
Number Of Programmable I/os
72
Number Of Timers
2
Operating Supply Voltage
0 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
Cpu Family
Mcore
Device Core
MCORE
Device Core Size
32b
Frequency (max)
33MHz
Total Internal Ram Size
8KB
# I/os (max)
72
Number Of Timers - General Purpose
2
Operating Supply Voltage (typ)
3.3/5V
Operating Supply Voltage (max)
3.6/5.5V
Operating Supply Voltage (min)
2.7/4.5V
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
144
Package Type
LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MMC2107CFCAG33
Manufacturer:
FREESCALE
Quantity:
210
Company:
Part Number:
MMC2107CFCAG33
Manufacturer:
freescaie
Quantity:
35
Company:
Part Number:
MMC2107CFCAG33
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
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MMC2107 – Rev. 2.0
MOTOROLA
1. All AC timing is shown with respect to 20% V
2. Timing is not guaranteed during the clock cycle of mode and/or setup changes (for example, changing pin function between
3. A[22:0], TSIZ[1:0], CS[3:0] valid to R/W (write), OE, EB asserted (minimum) spec is 0 ns. This parameter is characterized
4. Write/show data high-Z to OE asserted (minimum) or from EB negated (write — maximum) spec is 0 ns. This parameter
5. To prevent an unintentional assertion glitch of the EB pins during a synchronous reset (and before the reset overrides
6. SHS high to show data or write data invalid (minimum) spec is 0 ns. This parameter is characterized before qualification
7. Write/show data high-Z and write/show data invalid is 0 ns for synchronous reset conditions.
No.
24
25
26
27
GPIO and primary function, changing GPIO between input/output functions, changing control registers that affect pin
functions).
before qualification rather than 100% tested.
is characterized before qualification rather than 100% tested.
configure the chip in a stable mode), leave the port output data register bits associated with the EB GPO default of 1 and
do not pull the pins down with a current load.
rather than 100% tested.
Data-in valid to CLKOUT high read
CLKOUT high to data-in invalid read
TA, TEA asserted to CLKOUT high
CLKOUT high to TA, TEA negated
Table 22-11. External Interface Timing Characteristics (Continued)
CLKOUT
Characteristic
(V
4
DD
Freescale Semiconductor, Inc.
For More Information On This Product,
= 2.7 V to 3.6 V, V
Figure 22-3. CLKOUT Timing
(1), (2)
Go to: www.freescale.com
DD
Electrical Specifications
and 80% V
SS
DD
5
levels, unless otherwise noted.
= 0 V, T
2
Symbol
t
t
t
t
DIVCH
CHDII
TACH
CHTN
1
A
= T
External Interface Timing Characteristics
0.25 t
L
3
to T
Min
22
cyc
0
0
+ 14
H
)
Electrical Specifications
Max
—
—
—
—
Technical Data
Unit
ns
ns
ns
ns
597
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