DF2552BR26DV Renesas Electronics America, DF2552BR26DV Datasheet - Page 741

IC H8S/2552 MCU FLASH 176-LFBGA

DF2552BR26DV

Manufacturer Part Number
DF2552BR26DV
Description
IC H8S/2552 MCU FLASH 176-LFBGA
Manufacturer
Renesas Electronics America
Series
H8® H8S/2500r
Datasheets

Specifications of DF2552BR26DV

Core Processor
H8S/2000
Core Size
16-Bit
Speed
26MHz
Connectivity
I²C, SCI
Peripherals
POR, PWM, WDT
Number Of I /o
104
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 16x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
176-LFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2552BR26DV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
(4)
When flash memory is erased, the erase-block number on the user MAT must be passed to the
erasing program which is downloaded. This is set to the FEBS parameter (general register ER0).
One block is specified from the block number 0 to 15.
For details on the erasing processing procedure, see section 20.4.2, User Program Mode.
Bit
1
0
Erasure Execution
Bit Name
WA
SF
Initial
Value
R/W
R/W
R/W
Description
Write Address Error Detect
When the following items are specified as the start
address of the programming destination, an error occurs.
0: Setting of programming destination address is normal
1: Setting of programming destination address is
Success/Fail
Indicates whether the program processing is ended
normally or not.
0: Programming is ended normally (no error)
1: Programming is ended abnormally (error occurs)
abnormal
When the programming destination address in the
area other than flash memory is specified
When the specified address is not 128-byte
boundary (that is, A6 to A0 are not 0)
Rev. 6.00 Sep. 24, 2009 Page 693 of 928
Section 20 Flash Memory
REJ09B0099-0600

Related parts for DF2552BR26DV