DF2552BR26DV Renesas Electronics America, DF2552BR26DV Datasheet - Page 79
DF2552BR26DV
Manufacturer Part Number
DF2552BR26DV
Description
IC H8S/2552 MCU FLASH 176-LFBGA
Manufacturer
Renesas Electronics America
Series
H8® H8S/2500r
Specifications of DF2552BR26DV
Core Processor
H8S/2000
Core Size
16-Bit
Speed
26MHz
Connectivity
I²C, SCI
Peripherals
POR, PWM, WDT
Number Of I /o
104
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 16x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
176-LFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF2552BR26DV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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• Stack Structure
In advanced mode, when the program counter (PC) is pushed onto the stack in a subroutine
call, and the PC, condition-code register (CCR), and extended control register (EXR) are
pushed onto the stack in exception handling, they are stored as shown in figure 2.4. When
EXR is invalid, it is not pushed onto the stack. For details, see section 4, Exception Handling.
SP
Notes: 1. When EXR is not used it is not stored on the stack.
2. SP when EXR is not used.
3. Ignored when returning.
(a) Subroutine Branch
Figure 2.4 Stack Structure in Advanced Mode
Reserved
(24 bits)
PC
(SP
SP
*
2
)
Rev. 6.00 Sep. 24, 2009 Page 31 of 928
(b) Exception Handling
(24 bits)
EXR*
Reserved*
CCR
PC
1
1
*
3
REJ09B0099-0600
Section 2 CPU
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