PIC16LC774/PQ Microchip Technology, PIC16LC774/PQ Datasheet - Page 183

IC MCU OTP 4KX14 A/D PWM 44-MQFP

PIC16LC774/PQ

Manufacturer Part Number
PIC16LC774/PQ
Description
IC MCU OTP 4KX14 A/D PWM 44-MQFP
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Datasheets

Specifications of PIC16LC774/PQ

Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
33
Program Memory Size
7KB (4K x 14)
Program Memory Type
OTP
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 10x12b
Oscillator Type
External
Operating Temperature
0°C ~ 70°C
Package / Case
44-MQFP, 44-PQFP
Processor Series
PIC16LC
Core
PIC
Data Bus Width
8 bit
Data Ram Size
256 B
Interface Type
I2C, SPI, SSP, UART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
33
Number Of Timers
3 bit
Operating Supply Voltage
2.5 V to 5.5 V
Maximum Operating Temperature
+ 70 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000, DM163022
Minimum Operating Temperature
0 C
On-chip Adc
10 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16LC774/PQ
Manufacturer:
Microchip Technology
Quantity:
10 000
17.8
1999 Microchip Technology Inc.
K04-076 44-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.1 mm Lead Form
Units
Dimension Limits
Pitch
Number of Pins
Pins along Width
Overall Pack. Height
Shoulder Height
Standoff
Shoulder Radius
Gull Wing Radius
Foot Length
Foot Angle
Radius Centerline
Lead Thickness
Lower Lead Width
Outside Tip Length
Outside Tip Width
Molded Pack. Length
Molded Pack. Width
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
B
c
*
p
Controlling Parameter.
Dimension “B” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”
Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not
JEDEC equivalent:MS-026 ACB
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B.”
exceed 0.010” (0.254 mm) per side or 0.020” (0.508 mm) more than dimensions “D” or “E.”
# leads = n1
E1
E
p
n
n1
A
A1
A2
R1
R2
L
L1
c
B
D1
E1
D
E
X
R1
Advance Information
n
MIN
0.039
0.015
0.002
0.003
0.003
0.005
0.003
0.004
0.012
0.463
0.463
0.390
0.390
0.025
2
1
0
5
5
L1
X x 45°
D
L
INCHES
NOM
D1
R2
0.031
0.043
0.025
0.004
0.003
0.006
0.010
0.008
0.006
0.015
0.472
0.472
0.394
0.394
0.035
3.5
A2
44
11
10
12
A
MAX
0.047
0.035
0.006
0.010
0.008
0.015
0.013
0.008
0.018
0.482
0.482
0.398
0.398
0.045
15
15
7
MIN
11.75
11.75
1.00
0.38
0.05
0.08
0.08
0.13
0.08
0.09
0.30
9.90
9.90
0.64
0
5
5
MILLIMETERS*
PIC16C77X
NOM
12.00
12.00
10.00
10.00
0.80
1.10
0.64
0.10
0.08
0.14
0.25
0.20
0.15
0.38
0.89
3.5
44
11
10
12
DS30275A-page 183
A1
MAX
12.25
12.25
10.10
10.10
1.20
0.89
0.15
0.25
0.20
0.38
0.33
0.20
0.45
1.14
15
15
7

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