ST92F250CV2QB STMicroelectronics, ST92F250CV2QB Datasheet - Page 375
ST92F250CV2QB
Manufacturer Part Number
ST92F250CV2QB
Description
IC MCU 256K FLASH 100-PQFP
Manufacturer
STMicroelectronics
Series
ST9r
Datasheet
1.ST92F150CV1TB.pdf
(429 pages)
Specifications of ST92F250CV2QB
Core Processor
ST9
Core Size
8/16-Bit
Speed
24MHz
Connectivity
CAN, I²C, LIN, SCI, SPI
Peripherals
DMA, LVD, POR, PWM, WDT
Number Of I /o
80
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 105°C
Package / Case
100-QFP
Processor Series
ST92F25x
Core
ST9
Data Bus Width
8 bit, 16 bit
Data Ram Size
8 KB
Interface Type
CAN, I2C, SCI, SPI
Maximum Clock Frequency
24 MHz
Number Of Programmable I/os
80
Number Of Timers
5 x 16 bit
Operating Supply Voltage
4.5 V to 5.5 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Development Tools By Supplier
ST92F150-EPB
Minimum Operating Temperature
- 40 C
On-chip Adc
16 bit x 10 bit
Case
QFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
497-2139
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
ST92F250CV2QB
Manufacturer:
HKE
Quantity:
30 000
- Current page: 375 of 429
- Download datasheet (8Mb)
11 ELECTRICAL CHARACTERISTICS
This product contains devices to protect the inputs
against damage due to high static voltages, how-
ever it is advisable to take normal precautions to
avoid application of any voltage higher than the
specified maximum rated voltages.
For proper operation it is recommended that V
and V
Reliability is enhanced if unused inputs are con-
nected to an appropriate logic voltage level (V
or V
ABSOLUTE MAXIMUM RATINGS
Notes:
Stresses above those listed as “absolute maximum ratings“ may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect
device reliability. All voltages are referenced to V
Note 1: Pin injection current occurs when the voltage on any pin exceeds the specified range.
Note 2: Value guaranteed by design.
THERMAL CHARACTERISTICS
Symbol
SS
⎥I
V
Symbol
AV
AV
T
⎥I
V
V
⎥I
RthJA
V
INOD
TINJ
O
STG
).
INJ
AIN
DD
IO
IN
DD
SS
be higher than V
⎥
⎥
⎥
Supply Voltage
ADC Reference Voltage
ADC Ground
Input Voltage (all pins except pure open drain I/O pins)
Input Voltage (pure open drain I/O pins)
Analog Input Voltage (ADC inputs)
Storage Temperature
Load Current
Pin Injection Current - Digital and Analog Inputs
Absolute sum of all Pin Injection Current in the device
SS
PQFP100
LQFP100
and lower than V
Package
LQFP64
ST92F124/F150/F250 - ELECTRICAL CHARACTERISTICS
SS
Parameter
= 0 V.
DD
DD
IN
.
Power Considerations. The average chip-junc-
tion temperature, T
from:
Where: T
(1)
T
RthJA = Package thermal resistance
P
P
P
J
A
D
INT
PORT
=
=
Value
=
47
28
44
=
= Port power dissipation
(junction-to ambient).
(determined by the user)
T
Ambient Temperature.
P
I
DD
A
INT
– 0.3 to V
-0.3 to AV
J
V
+ P
, in Celsius can be obtained
x V
SS
– 55 to +150
+ P
– 0.3 to 6.5
– 0.3 to 6.5
to V
D
100
DD
Value
10
10
V
PORT
x RthJA
SS
DD
(chip internal power).
(2)
(2)
DD
(2)
DD
+ 0.3
+ 0.3
.
+ 0.3
°C/W
Unit
Unit
375/429
mA
mA
mA
°C
V
V
V
V
V
1
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