ST7FMC1K2B6 STMicroelectronics, ST7FMC1K2B6 Datasheet - Page 288

MCU 8BIT 8K FLASH 32DIP

ST7FMC1K2B6

Manufacturer Part Number
ST7FMC1K2B6
Description
MCU 8BIT 8K FLASH 32DIP
Manufacturer
STMicroelectronics
Series
ST7r
Datasheet

Specifications of ST7FMC1K2B6

Core Processor
ST7
Core Size
8-Bit
Speed
8MHz
Connectivity
LINSCI
Peripherals
LVD, Motor Control PWM, POR, PWM, WDT
Number Of I /o
17
Program Memory Size
8KB (8K x 8)
Program Memory Type
FLASH
Ram Size
384 x 8
Voltage - Supply (vcc/vdd)
3.8 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
32-DIP (0.600", 15.24mm)
For Use With
497-8402 - BOARD EVAL COMPLETE INVERTER497-8400 - KIT IGBT PWR MODULE CTRL ST7MC497-4734 - EVAL KIT 3KW POWER DRIVER BOARD497-4733 - EVAL KIT 1KW POWER DRIVER BOARD497-4732 - EVAL KIT 300W POWER DRIVER BOARD497-4731 - EVAL KIT PWR DRIVER CONTROL BRD
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Other names
497-4864
ST7MC1xx/ST7MC2xx
PACKAGE CHARACTERISTICS (Cont’d)
13.2 THERMAL CHARACTERISTICS
Notes:
1. The maximum chip-junction temperature is based on technology characteristics.
2. The maximum power dissipation is obtained from the formula P
The power dissipation of an application can be defined by the user with the formula: P
where P
the ports used in the application.
288/309
Symbol
P
INT
T
R
Dmax
Jmax
thJA
is the chip internal power (I
Package thermal resistance (junction to ambient)
Maximum junction temperature
Power dissipation
2)
DD
x V
Ratings
DD
) and P
1)
PORT
LQFP80 14x14
LQFP64 14x14
LQFP44 10x10
SDIP32 400mil
SDIP56 600mil
LQFP32 7x7
is the port power dissipation depending on
D
= (T
J
-T
A
) / R
Value
thJA
150
500
55
55
68
80
63
45
.
D
=P
INT
+P
°C/W
Unit
mW
°C
PORT

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