HD6417760BP200QS Renesas Electronics America, HD6417760BP200QS Datasheet - Page 401

IC SUPERH MCU ROMLESS 256BGA

HD6417760BP200QS

Manufacturer Part Number
HD6417760BP200QS
Description
IC SUPERH MCU ROMLESS 256BGA
Manufacturer
Renesas Electronics America
Series
SuperH® SH7750r
Datasheet

Specifications of HD6417760BP200QS

Core Processor
SH-4
Core Size
32-Bit
Speed
200MHz
Connectivity
Audio Codec, CAN, EBI/EMI, FIFO, I²C, MFI, MMC, SCI, Serial Sound, SIM, SPI, USB
Peripherals
DMA, LCD, POR, WDT
Number Of I /o
69
Program Memory Type
ROMless
Ram Size
48K x 8
Voltage - Supply (vcc/vdd)
1.4 V ~ 1.6 V
Data Converters
A/D 4x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
256-BGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Section 10 Bus State Controller (BSC)
(4) DCK, BS2, and CS1 Timing when Setting Clock Division Register
Figure 10.13 shows the SRAM read timing when the division ratio is set to CKIO/2 by DIV[1:0]
in DCKDR.
TS1
T1
Tw
Tw
Tw
T2
TH1
TH2
CKIO
A25 −A 0
CS1
RD/WR
RD
D31 − D0
(read)
BS
DCK
BS2
Figure 10.13 DCK, BS2, and CS1 Timing when Reading SRAM Interface
(DCKDR = H'0002, A1RDH = 1 and A1H[1:0] = 10 in WCR3,
CSH[1:0] in WCR4 = 10, Three Wait Cycles)
Rev. 2.00 Feb. 12, 2010 Page 317 of 1330
REJ09B0554-0200

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