TLP200G-1 STMicroelectronics, TLP200G-1 Datasheet - Page 13

• Manufacturer Part Number: TLP200G-1
• Description: IC OVP TRIPOLAR TELECOM I2PAK
• Manufacturer: STMicroelectronics

Specifications of TLP200G-1

• Voltage - Working: 180V
• Voltage - Clamping: 200V
• Technology: Mixed Technology
• Number Of Circuits: 1
• Applications: Telecommunications
• Package / Case: I²Pak, TO-262 (3 straight leads + tab)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power (watts): -

SUBSTRATES AND MOUNTING INFORMATION
The use of epoxy FR4 boards is quite common for
surface mounting techniques, however, their poor
thermal conduction compromises the
outstanding thermal performance of the PowerSO-
10. Some methods to overcome this limitation are
discussed below.
One possibility to improve the thermal conduction
is the use of large heat spreader areas at the cop-
per layer of the PC board. This leads to a reduction
of thermal resistance to 35 °C for 6 cm
board heatsink (see fig. 2).
Use of copper-filled through holes on conventional
FR4 techniques will increase the metallization and
Fig. 3 : Mounting on epoxy FR4 by using copper-filled through holes for heat transfer
Fig. 2 : Mounting on epoxy FR4 head dissipation by extending the area of the copper layer
Copper foil
Copper foil
heatsink
otherwise
2
of the
decrease thermal resistance accordingly. Using
a configuration with 16 holes under the spreader of
the package with a pitch of 1.8 mm and a diameter
of 0.7 mm, the thermal resistance (junction -
heatsink) can be reduced to 12°C/W (see fig. 3).
Beside the thermal advantage, this solution allows
multi-layer boards to be used. However, a draw-
back of this traditional material prevents its use in
very high power, high current circuits. For instance,
it is not advisable to surface mount devices with
currents greater than 10 A on FR4 boards. A
Power Mosfet or Schottky diode in a surface mount
power package can handle up to around 50 A if
better substrates are used.
heat transfer
FR4 board
FR4 board
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