MC9S08AC32CPUE Freescale Semiconductor, MC9S08AC32CPUE Datasheet - Page 305

• Manufacturer Part Number: MC9S08AC32CPUE
• Description: IC MCU 8BIT 32K FLASH 64-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08AC32CPUE

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 54
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-LQFP
• Processor Series: S08AC
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 2 KB
• Interface Type: I2C, SCI, SPI
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 54
• Number Of Timers: 3
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMO9S08AC60E, DEMOACEX, DEMOACKIT, DCF51AC256, DC9S08AC128, DC9S08AC16, DC9S08AC60, DEMO51AC256KIT
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 16 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

A.4
This section provides information about operating temperature range, power dissipation, and package
thermal resistance. Power dissipation on I/O pins is usually small compared to the power dissipation in
on-chip logic and it is user-determined rather than being controlled by the MCU design. In order to take
P
V
loads), the difference between pin voltage and V
Freescale Semiconductor
I/O
DD
into account in power calculations, determine the difference between actual pin voltage and V
and multiply by the pin current for each I/O pin. Except in cases of unusually high pin current (heavy
Thermal Characteristics
1
2
3
4
Operating temperature range (packaged)
Thermal resistance
64-pin QFP
64-pin LQFP
48-pin QFN
44-pin LQFP
32-pin LQFP
Junction temperature is a function of die size, on-chip power dissipation, package thermal
resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation
of other components on the board, and board thermal resistance.
Junction to Ambient Natural Convection
1s - Single Layer Board, one signal layer
2s2p - Four Layer Board, 2 signal and 2 power layers
1,2,3,4
Rating
MC9S08AC60 Series Data Sheet, Rev. 2
Table A-3. Thermal Characteristics
SS
or V
Appendix A Electrical Characteristics and Timing Specifications
2s2p
2s2p
2s2p
2s2p
2s2p
DD
1s
1s
1s
1s
1s
will be very small.
Symbol
θ
T
JA
A
–40 to 125
T
Value
L
57
43
69
54
84
27
73
56
85
56
to T
H
°C/W
Unit
°C
SS
or
305