MCIMX357DVM5B Freescale Semiconductor, MCIMX357DVM5B Datasheet - Page 50

PROCESSOR MULTIMEDIA 400PBGA

MCIMX357DVM5B

Manufacturer Part Number
MCIMX357DVM5B
Description
PROCESSOR MULTIMEDIA 400PBGA
Manufacturer
Freescale Semiconductor
Series
i.MX35r
Datasheet

Specifications of MCIMX357DVM5B

Core Processor
ARM11
Core Size
32-Bit
Speed
532MHz
Connectivity
1-Wire, CAN, EBI/EMI, Ethernet, I²C, MMC, SPI, SSI, UART/USART, USB OTG
Peripherals
DMA, I²S, LCD, POR, PWM, WDT
Number Of I /o
96
Program Memory Type
ROMless
Ram Size
128K x 8
Voltage - Supply (vcc/vdd)
1.33 V ~ 1.47 V
Oscillator Type
External
Operating Temperature
-20°C ~ 70°C
Package / Case
400-BGA
Operating Temperature (min)
-20C
Operating Temperature (max)
70C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Embedded Interface Type
CAN, I2C, SPI, UART, USB
Digital Ic Case Style
BGA
No. Of Pins
400
Operating Temperature Range
-20°C To +70°C
Processor Type
I.MX35
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-
Lead Free Status / Rohs Status
Compliant

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50
DDR1
DDR2
DDR3
DDR4
ID
SD16
ID
SDCLK
SDCLK
ADDR
RAS
CAS
SDRAM clock high-level width
SDRAM clock low-level width
SDRAM clock cycle time
CS, RAS, CAS, CKE, WE setup time
WE
CKE
CS
DDR6
DDR4
CKE output delay time
DDR4
The clock will continue to run unless both CKEs are low. Then the clock
will be stopped in low state.
i.MX35 Applications Processors for Industrial and Consumer Products, Rev. 9
ROW/BA
Table 36. SDRAM Self-Refresh Cycle Timing Parameters
Figure 31. DDR2 SDRAM Basic Timing Parameters
DDR5
Table 37. DDR2 SDRAM Timing Parameter Table
Parameter
DDR5
PARAMETER
DDR7
DDR4
DDR4
COL/BA
DDR4
NOTE
DDR5
DDR5
DDR1
Symbol
DDR3
tCKS
Symbol
t
t
t
t
IS
CH
CL
CK
DDR2
1
Min.
1.8
0.45
0.45
0.35
Min
7.0
DDR2-400
Freescale Semiconductor
Max.
Max
0.55
0.55
8.0
Unit
ns
Unit
t
t
ns
ns
CK
CK

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