MCF5272CVM66 Freescale Semiconductor, MCF5272CVM66 Datasheet - Page 191

IC MPU 66MHZ COLDFIRE 196-MAPBGA

MCF5272CVM66

Manufacturer Part Number
MCF5272CVM66
Description
IC MPU 66MHZ COLDFIRE 196-MAPBGA
Manufacturer
Freescale Semiconductor
Series
MCF527xr
Datasheets

Specifications of MCF5272CVM66

Core Processor
Coldfire V2
Core Size
32-Bit
Speed
66MHz
Connectivity
EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB
Peripherals
DMA, WDT
Number Of I /o
32
Program Memory Size
16KB (4K x 32)
Program Memory Type
ROM
Ram Size
1K x 32
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
196-MAPBGA
Cpu Speed
66MHz
Embedded Interface Type
UART, QSPI, USB, TDM
Digital Ic Case Style
BGA
No. Of Pins
196
Supply Voltage Range
3V To 3.6V
Rohs Compliant
Yes
Family Name
MCF5xxx
Device Core
ColdFire
Device Core Size
32b
Frequency (max)
66MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
3.3V
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
196
Package Type
MA-BGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Lead Free Status / Rohs Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCF5272CVM66
Manufacturer:
MOT
Quantity:
3
Part Number:
MCF5272CVM66
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MCF5272CVM66
Manufacturer:
FREESCALE
Quantity:
20 000
Part Number:
MCF5272CVM66
0
Company:
Part Number:
MCF5272CVM66
Quantity:
6 000
Part Number:
MCF5272CVM66J
Manufacturer:
NSC
Quantity:
36
Part Number:
MCF5272CVM66J
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MCF5272CVM66R2
0
Chapter 9
SDRAM Controller
This chapter describes configuration and operation of the synchronous DRAM controller component of
the SIM including a general description of signals involved in SDRAM operations. It provides interface
information for memory configurations using most common SDRAM devices for both 16- and 32-bit wide
data buses. The chapter concludes with signal timing diagrams.
9.1
The MCF5272 incorporates an SDRAM controller, whose main features are as follows:
9.2
The SDRAM controller provides all required signals for glueless interfacing to a variety of
JEDEC-compliant SDRAM devices. RAS/CAS address multiplexing and the SDRAM pin A10
auto-precharge function is software configurable for different page sizes. To maintain refresh capability
without conflicting with concurrent accesses on the address and data buses, RAS0, CAS0, SDWE,
SDBA[0:1], SDCLKE, A10_PRECHG, and the SDRAM bank selects are dedicated SDRAM signals.
Figure 9-1
Freescale Semiconductor
Glueless interface to a variety of JEDEC-compliant SDRAM devices.
MCF5272 data bus width of 16 or 32 bits to SDRAM memory array
16- to 256-Mbit device support
Dedicated bank address pins to provide pin out compatibility for different SDRAM sizes with a
single printed circuit board layout
Page size from 256–1024 column address locations
6-1-1-1 timing for burst-read; 3-1-1-1 timing for burst-write accesses (assuming a page hit at 66
MHz)
CAS latencies of 1 and 2
Up to four concurrently activated banks
SDRAM power down and self refresh
Refresh timer prescaler supports system clock down to 5 MHz maintaining a 15.6-µS refresh cycle
Auto initialization of SDRAM
Overview
SDRAM Controller Signals
shows the SDRAM controller signal configuration.
MCF5272 ColdFire
®
Integrated Microprocessor User’s Manual, Rev. 3
9-1

Related parts for MCF5272CVM66