OM7602/BGA2022/2450 NXP Semiconductors, OM7602/BGA2022/2450 Datasheet - Page 3

• Manufacturer Part Number: OM7602/BGA2022/2450
• Description: EVAL BOARD FOR BGA2022
• Manufacturer: NXP Semiconductors
• Type: Mixer, MMICr

Specifications of OM7602/BGA2022/2450

• Frequency: 0Hz ~ 2.4GHz
• For Use With/related Products: BGA2711
• Lead Free Status / RoHS Status: Not applicable / Not applicable

NXP Semiconductors
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
Notes
1. LO and RF signals always AC coupled; 50  source; no external DC voltage supplied to pins 1, 2 and 6.
2. T
THERMAL CHARACTERISTICS
CHARACTERISTICS
V
2000 Dec 04
V
I
P
P
P
T
T
R
I
G
NF
IP
VSWR
S
S
S
SYMBOL
SYMBOL
SYMBOL
stg
j
S
LO
RF
tot
MMIC mixer
th j-s
conv(p)
3
= 2.8 V; I
s
is the temperature at the soldering point of the ground tab.
LO
S
= 6 mA; T
supply voltage
supply current
oscillator power
RF power
total power dissipation
storage temperature
junction temperature
thermal resistance from junction to solder point
supply current
power conversion gain
noise figure
intercept point third order input
return losses at LO port
880 MHz
1800 MHz
1950 MHz
2450 MHz
880 MHz
1800 MHz
1950 MHz
2450 MHz
880 MHz
1800 MHz
1950 MHz
2450 MHz
j
= 25 C; unless otherwise specified.
PARAMETER
PARAMETER
PARAMETER
note 1
note 1
T
V
P
DSB
output referred
P
s
S
RF
LO
 100 C; note 2
= 2.8 V
= 25 dBm; P
= 0 dBm; f = 0 to 3 GHz
3
CONDITIONS
CONDITIONS
LO
= 0 dBm





65

4

4











MIN.
MIN.
VALUE
375
6
5
6
5
6
9
12
9
9
4
7
7
10

TYP.
4
10
10
10
40
+150
150
Product specification
MAX.
BGA2022
8

8










2:1
MAX.
UNIT
K/W
V
mA
dBm
dBm
mW
C
C
UNIT
mA
dB
dB
dB
dB
dB
dB
dB
dB
dBm
dBm
dBm
dBm
UNIT