TEA6843HL/V1,557 NXP Semiconductors, TEA6843HL/V1,557 Datasheet - Page 2

• Manufacturer Part Number: TEA6843HL/V1,557
• Description: IC CAR RADIO TUNER 80-LQFP
• Manufacturer: NXP Semiconductors

Specifications of TEA6843HL/V1,557

• Frequency: AM, FM, WB
• Modulation Or Protocol: AM, FM
• Applications: AM/FM Radio Receiver
• Current - Receiving: 90mA
• Data Interface: PCB, Surface Mount
• Antenna Connector: PCB, Surface Mount
• Voltage - Supply: 2.5 V ~ 12 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 80-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Sensitivity: -
• Memory Size: -
• Data Rate - Maximum: -
• Other names: 935268098557; TEA6843HL/V1; TEA6843HL/V1

Philips Semiconductors
CONTENTS
1
2
3
4
5
6
7
7.1
7.1.1
7.1.2
7.1.3
7.2
7.2.1
7.2.2
7.2.3
7.2.4
7.2.5
7.2.6
7.3
7.3.1
7.3.2
7.3.3
7.3.4
7.3.5
7.4
7.5
7.6
8
9
10
11
2003 Dec 19
New In Car Entertainment (NICE)
extended car radio
FEATURES
GENERAL DESCRIPTION
ORDERING INFORMATION
QUICK REFERENCE DATA
BLOCK DIAGRAM
PINNING
FUNCTIONAL DESCRIPTION
Oscillators
VCO
Crystal oscillator
PLL
FM signal channel
DAA
FM I/Q mixer
FM keyed AGC
FM IF amplifiers
FM demodulator
FM MPX soft mute
AM signal channel
AM tuner
AM RF AGC and IF2 AGC
AM AF or IF2 switch
AM soft mute
AM noise blanker
FM and AM level detector
Buffer output for weather band flag
Test mode
LIMITING VALUES
THERMAL CHARACTERISTICS
DC CHARACTERISTICS
AC CHARACTERISTICS
2
12
12.1
12.1.1
12.1.2
12.1.3
12.1.4
12.2
12.2.1
12.2.2
12.2.3
12.2.4
12.2.5
12.2.6
12.2.7
12.2.8
12.2.9
13
14
15
16
16.1
16.2
16.3
16.4
16.5
17
18
19
20
I
I
Data transfer
I
Frequency setting
Default settings
I
Data transfer mode and IC address
Write mode: data byte 1
Write mode: data byte 2
Write mode: data byte 3
Write mode: data byte 4
Write mode: data byte 5
Write mode: data byte 6
Write mode: data byte 7
Read mode: data byte 1
TEST AND APPLICATION INFORMATION
INTERNAL CIRCUITRY
PACKAGE OUTLINE
SOLDERING
Introduction to soldering surface mount
packages
Reflow soldering
Wave soldering
Manual soldering
Suitability of surface mount IC packages for
wave and reflow soldering methods
DATA SHEET STATUS
DEFINITIONS
DISCLAIMERS
PURCHASE OF PHILIPS I
2
2
2
2
C-BUS PROTOCOL
C-bus specification
C-bus pull-up resistors
C-bus protocol
Product specification
TEA6843HL
2
C COMPONENTS