WISMC03BI Laird Technologies, WISMC03BI Datasheet - Page 22
![MODULE LAN 802.11B/G BISM](/photos/14/19/141968/wismc03bi_sml.jpg)
WISMC03BI
Manufacturer Part Number
WISMC03BI
Description
MODULE LAN 802.11B/G BISM
Manufacturer
Laird Technologies
Series
EZURiOr
Specifications of WISMC03BI
Frequency
2.4GHz
Data Rate - Maximum
1Mbps
Modulation Or Protocol
802.11 b/g
Applications
AMR, Automotive, ISM
Power - Output
15dBm
Sensitivity
-86dBm
Voltage - Supply
3.3 V ~ 5.5 V
Current - Transmitting
250mA
Data Interface
Connector, 50 Pin, DF-12
Memory Size
64Mbyte Flash, 16MByte SRAM
Antenna Connector
U.FL
Operating Temperature
-40°C ~ 85°C
Package / Case
Module
Wireless Frequency
2.412 GHz to 2.484 GHz
Interface Type
UART
Board Size
22.8 mm x 33.8 mm x 7.6 mm
Modulation
BPSK, CCK, DSSS, QPSK
Security
WEP 64/128, WPA-PSK, WPA2, TKIP, AES-CCMP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Receiving
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
WISMC03BI
Wireless LAN Module / Device Server
RELATED
DOCUMENTS
22 www.lairdtech.com
RELATED DOCUMENTS
AN008 - Wireless Development Kit User Guide
AN016 - Notification Requirements for Wireless Products.
AN017 – Interfacing to the WISM ADC input
WHP-050004-1V0 Bluetooth and 802.11 Coexistence
WISM SLIP Programming Manual
Documents are available for download from www.lairdtech.com
DEVELOPMENT KIT
Laird Technologies offers a Wireless Development Kit for embedded developers which is unique in supporting
Bluetooth, 802.11 and GSM/GPRS. It provides a simple design environment that can dramatically reduce the
development time of wirelessly enabled products.
The Wireless Development Kit is available with Laird Technologies’ pre-qualified Bluetooth and 802.11 Wireless
LAN modules and accepts both 40 pin and 50 pin versions of these modules.
Laird Technologies’ modules contain embedded protocol stacks, removing the need for complex programming
on a host processor.
Features:
A range of codec audio development boards for Bluetooth voice applications are available. These can be
plugged into the wireless development kit for rapid of audio applications.
For cellular applications, the Wireless Development Kit also supports Siemens’ MC55 range of GSM/GPRS
modules, which are pin compatible with Laird Technologies’ wireless LAN module. This permits designers
to develop products which can support either short range or wide area wireless connectivity, with incredibly
fast time to market.
Bluetooth
802.11b/g
• Complete, qualified Bluetooth stack
• Support for Version 2.0
• Upgradeable for Bluetooth 2.1 when available
• Simple AT style programming interface
• Audio codec evaluation kits available
• Enhanced drivers for low power operation
• Robust TCP/IP stack or UDP/SLIP
• Integrated Web Server (TCP/IP version only)
• Embedded interpreter (UWScript) for fast development (TCP/IP version only)
Laird Technologies