WISMC03BI Laird Technologies, WISMC03BI Datasheet - Page 4

• Manufacturer Part Number: WISMC03BI
• Description: MODULE LAN 802.11B/G BISM
• Manufacturer: Laird Technologies
• Series: EZURiOr

Specifications of WISMC03BI

• Frequency: 2.4GHz
• Data Rate - Maximum: 1Mbps
• Modulation Or Protocol: 802.11 b/g
• Applications: AMR, Automotive, ISM
• Power - Output: 15dBm
• Sensitivity: -86dBm
• Voltage - Supply: 3.3 V ~ 5.5 V
• Current - Transmitting: 250mA
• Data Interface: Connector, 50 Pin, DF-12
• Memory Size: 64Mbyte Flash, 16MByte SRAM
• Antenna Connector: U.FL
• Operating Temperature: -40°C ~ 85°C
• Package / Case: Module
• Wireless Frequency: 2.412 GHz to 2.484 GHz
• Interface Type: UART
• Board Size: 22.8 mm x 33.8 mm x 7.6 mm
• Modulation: BPSK, CCK, DSSS, QPSK
• Security: WEP 64/128, WPA-PSK, WPA2, TKIP, AES-CCMP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Receiving: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

WISMC03BI
Wireless LAN Module / Device Server
OVERVIEW AND
KEY FEATURES
4
www.lairdtech.com
Laird Technologies’ 802.11b/g SLIP Wireless LAN Module is a fully integrated and qualified wireless device
server sub-system, designed to make it simple to embed 802.11 connectivity. It has been designed to be
pin compatible with the footprint of Siemens MC55 GPRS modules, allowing designers to design one pcb
to support either GPRS or Wireless LAN connectivity.
Unlike other wireless modules all of the necessary drivers, protocol stack, security algorithms up to the host
TCP/IP interface are integrated, along with a high performance antenna. The 802.11b/g SLIP Wireless LAN
module is designed for applications with an existing host processor running a TCP/IP stack and provides a
fast and efficient way to convert a product from a wired to a wireless connection. It enables designers to
add wireless internet connectivity to almost any device with a serial port and TCP/IP stack. The module is
designed for the lowest cost of integration and ownership. It is ideal for enabling M2M applications.
The module is a dual processor design, dedicating one processor to the 802.11b/g baseband with a second
powerful ARM7 processor, with 16MB of SRAM and 64MB of flash memory running the wireless drivers,
UDP stack with SLIP interface and command interpreter. Connection to the host device is via a high
speed 921,600 bps UART, with an additional twelve GPIO lines and two 10 bit ADCs. The module has a
comprehensive set of commands giving high level access to wireless network management, simplifying
the task of connecting to the 802.11 infrastructure.
The UART is used to carry both control and data frames. Frames transferred across this interface are
encapsulated in a simple SLIP protocol. Data frames are presented as 802.3 packets; control frames employ
high level commands to configure and control the module’s operation. Because the module integrates the
802.11b/g drivers, it provides independence from the proprietary nature of wireless silicon implementations,
saving a significant amount of development time and making integration totally independent of the host
operating system.
The twelve GPIO and two analogue input lines can be configured using commands to provide control or
monitoring of simple devices such as switches or LEDs without requiring any external processing.
The module includes a high sensitivity, high gain antenna which provides excellent range. Typical open field
performance yields an operating range up to 100 meters. A second 50 Ohm U.FL connection is provided for an
external antenna. This can be used in place of the internal antenna, or in conjunction with the internal antenna
to implement antenna diversity for improved receive performance.
Support is provided for low power modes that make the Wireless LAN module particularly applicable to battery
powered installations. It has been designed to ensure the best co-existence with other devices operating within
the same frequency spectrum and has hardware support designed into the module for 2 and 3-wire Bluetooth
co-existence schemes.
The Wireless LAN module is supplied in a small pcb form factor (22.8mm x 33.8mm x 7.6mm), that connects
to a main pcb using a 40 way Hirose connector which is pin compatible with the Laird Technologies Bluetooth
Intelligent Serial Module BISMII. The module is Lead-free and RoHS compliant and supports an industrial
operational temperature range of -40°C to +85°C.
The module has FCC modular certification, Industry Canada certification and CE approval. These approvals
allow users to simplify or bypass RF regulatory testing, enhancing time to market and reducing approvals time
and cost.
APPLICATION AREAS
• POS equipment
• Automotive applications
• Medical equipment
• Street furniture
• Telematics
• Industrial automation
• Metering applications
Laird Technologies
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