MF1PLUS6001DA4/03, NXP Semiconductors, MF1PLUS6001DA4/03, Datasheet - Page 3
![IC SMART CARD 2KB EEPROM MOA4](/photos/26/96/269610/sot500-1_sml.jpg)
MF1PLUS6001DA4/03,
Manufacturer Part Number
MF1PLUS6001DA4/03,
Description
IC SMART CARD 2KB EEPROM MOA4
Manufacturer
NXP Semiconductors
Series
MIFARE PLUS™r
Datasheet
1.MF1PLUS6001DUD03.pdf
(20 pages)
Specifications of MF1PLUS6001DA4/03,
Rf Type
Read / Write
Frequency
13.56MHz
Features
ISO14443-3, 2KB EEPROM
Package / Case
PLLMC
Security
MIFARE CRYPTO1, AES
Product
Smart Card
Data Rate
848 Kbps
Antenna
On-Board
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
NXP Semiconductors
5. Ordering information
Table 2.
MF1PLUSX0Y1_SDS_31
Product short data sheet
PUBLIC
Type number
MF1PLUS8001DUD/03
MF1PLUS8001DA4/03
MF1PLUS8011DUD/03
MF1PLUS8021DUD/03
MF1PLUS8011DA4/03
MF1PLUS8021DA4/03
MF1PLUS6001DUD/03
MF1PLUS6001DA4/03
MF1PLUS6011DUD/03
MF1PLUS6021DUD/03
MF1PLUS6011DA4/03
MF1PLUS6021DA4/03
Ordering information
Package
Commercial
name
FFC
MOA4
FFC
FFC
MOA4
MOA4
FFC
MOA4
FFC
FFC
MOA4
MOA4
All information provided in this document is subject to legal disclaimers.
Name
-
PLLMC
-
-
PLLMC
PLLMC
-
PLLMC
-
-
PLLMC
PLLMC
Rev. 3.1 — 19 April 2010
163531
Description
8 inch wafer (sawn; 120 µm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see
4 kB EEPROM, 7-byte UID, L1 card
plastic leadless module carrier package; 35 mm
wide tape, 4 kB EEPROM, 7-byte UID, L1 card
8 inch wafer (sawn; 120 µm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see
4 kB EEPROM, 4-byte UID, L1 card
8 inch wafer (sawn; 120 µm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see
4 kB EEPROM, 4-byte UID, UID0 = XFh
according to ISO/IEC 14443-3, L1 card
plastic leadless module carrier package; 35 mm
wide tape, 4 kB EEPROM, 4-byte UID, L1 card
plastic leadless module carrier package; 35 mm
wide tape, 4 kB EEPROM, 4-byte UID,
UID0 = XFh according to ISO/IEC 14443-3, L1
card
8 inch wafer (sawn; 120 µm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see
2 kB EEPROM, 7-byte UID, L1 card
plastic leadless module carrier package; 35 mm
wide tape, 2 kB EEPROM, 7-byte UID, L1 card
8 inch wafer (sawn; 120 µm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see
2 kB EEPROM, 4-byte UID, L1 card
8 inch wafer (sawn; 120 µm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see
2 kB EEPROM, 4-byte UID, UID0 = XFh
according to ISO/IEC 14443-3, L1 card
plastic leadless module carrier package; 35 mm
wide tape, 2 kB EEPROM, 4-byte UID, L1 card
plastic leadless module carrier package; 35 mm
wide tape, 2 kB EEPROM, 4-byte UID,
UID0 = XFh according to ISO/IEC 14443-3, L1
card
Mainstream contactless smart card IC
MF1PLUSx0y1
Ref.
Ref.
Ref.
Ref.
Ref.
Ref.
3,
3,
3,
3,
3,
3,
© NXP B.V. 2010. All rights reserved.
Version
-
SOT500-2
-
-
SOT500-2
SOT500-2
-
SOT500-2
-
-
SOT500-2
SOT500-2
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