LPC1111FHN33/202,5 NXP Semiconductors, LPC1111FHN33/202,5 Datasheet - Page 42
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LPC1111FHN33/202,5
Manufacturer Part Number
LPC1111FHN33/202,5
Description
IC MCU LV 32BIT 8K FLASH 32VQFN
Manufacturer
NXP Semiconductors
Series
LPC1100Lr
Datasheets
1.LPC1114FHN333015.pdf
(2 pages)
2.LPC1114FHN333015.pdf
(66 pages)
3.LPC1114FHN333015.pdf
(66 pages)
Specifications of LPC1111FHN33/202,5
Featured Product
LPC1100L 32-Bit MCU
Core Processor
ARM Cortex-M0
Core Size
32-Bit
Speed
50MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, WDT
Number Of I /o
28
Program Memory Size
8KB (8K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
32-VQFN Exposed Pad
Processor Series
LPC1111
Core
ARM Cortex-M0
Data Bus Width
32 bit
Data Ram Size
2 KB
Interface Type
I2C, UART, SPI, SSP
Maximum Clock Frequency
50 MHz
Number Of Programmable I/os
42
Number Of Timers
4
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Other names
568-5143
NXP Semiconductors
LPC1111_12_13_14
Product data sheet
Fig 15. Sleep mode: Typical supply current I
(1) System oscillator and system PLL disabled; IRC enabled.
(2) System oscillator and system PLL enabled; IRC disabled.
(mA)
I
DD
Conditions: V
SYSAHBCLKCTRL register (SYSAHBCLKCTRL = 0x1F); all peripheral clocks disabled; internal
pull-up resistors disabled; BOD disabled; low-current mode.
clock frequencies (for LPC111x/102/202/302)
6
4
2
0
−40
All information provided in this document is subject to legal disclaimers.
DD
Rev. 4 — 10 February 2011
= 3.3 V; sleep mode entered from flash; all peripherals disabled in the
−15
10
DD
versus temperature for different system
32-bit ARM Cortex-M0 microcontroller
35
LPC1111/12/13/14
48 MHz
36 MHz
24 MHz
12 MHz
(2)
(2)
(2)
(1)
60
temperature (°C)
002aaf982
© NXP B.V. 2011. All rights reserved.
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