LPC1113FHN33/302,5 NXP Semiconductors, LPC1113FHN33/302,5 Datasheet - Page 43
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LPC1113FHN33/302,5
Manufacturer Part Number
LPC1113FHN33/302,5
Description
IC MCU LV 32BIT 24K FLAS 32VQFN
Manufacturer
NXP Semiconductors
Series
LPC1100Lr
Datasheet
1.LPC1114FHN333015.pdf
(66 pages)
Specifications of LPC1113FHN33/302,5
Featured Product
LPC1100L 32-Bit MCU
Core Processor
ARM Cortex-M0
Core Size
32-Bit
Speed
50MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, WDT
Number Of I /o
28
Program Memory Size
24KB (24K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
32-VQFN Exposed Pad
Processor Series
LPC1113
Core
ARM Cortex-M0
Data Bus Width
32 bit
Data Ram Size
8 KB
Interface Type
I2C, UART, SPI, SSP
Maximum Clock Frequency
50 MHz
Number Of Programmable I/os
42
Number Of Timers
4
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Other names
568-5148
NXP Semiconductors
LPC1111_12_13_14
Product data sheet
Fig 16. Deep-sleep mode: Typical supply current I
Fig 17. Deep power-down mode: Typical supply current I
(μA)
(μA)
I
I
DD
DD
5.5
4.5
3.5
2.5
1.5
0.8
0.6
0.4
0.2
Conditions: BOD disabled; all oscillators and analog blocks disabled in the PDSLEEPCFG register
(PDSLEEPCFG = 0x0000 18FF).
supply voltages V
different supply voltages V
0
−40
−40
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 10 February 2011
−15
−15
DD
(for LPC111x/102/202/302)
V
DD
= 3.3 V, 3.6 V
DD
10
10
(for LPC111x/102/202/302)
1.8 V
32-bit ARM Cortex-M0 microcontroller
35
DD
35
LPC1111/12/13/14
versus temperature for different
DD
V
DD
versus temperature for
= 3.6 V
3.3 V
1.8 V
60
60
temperature (°C)
temperature (°C)
002aaf977
002aaf978
© NXP B.V. 2011. All rights reserved.
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