LPC1112FHN33/202,5 NXP Semiconductors, LPC1112FHN33/202,5 Datasheet - Page 6

IC MCU LV 32BIT 16K FLAS 32VQFN

LPC1112FHN33/202,5

Manufacturer Part Number
LPC1112FHN33/202,5
Description
IC MCU LV 32BIT 16K FLAS 32VQFN
Manufacturer
NXP Semiconductors
Series
LPC1100Lr

Specifications of LPC1112FHN33/202,5

Core Processor
ARM Cortex-M0
Core Size
32-Bit
Speed
50MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, WDT
Number Of I /o
28
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
32-VQFN Exposed Pad
Processor Series
LPC1112
Core
ARM Cortex-M0
Data Bus Width
32 bit
Data Ram Size
4 KB
Interface Type
I2C, UART, SPI, SSP
Maximum Clock Frequency
50 MHz
Number Of Programmable I/os
42
Number Of Timers
4
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details
Other names
568-5145
Instruction set architecture
Based on 16-bit Thumb ISA from ARM7TDMI
Thumb
User assembly code, compiler generated
– Just 56 instructions, all with guaranteed execution time
– 8, 16 or 32-bit data transfers possible in one instruction
LDRSH
REVSH
ADC
EOR
ORR
STM
TST
BIC
BKPT
SXTB
ADD
LDM
POP
STR
LSL
BL
PUSH
STRB
SXTH
ADR
LDR
LSR
BLX
LDRB
STRH
UXTB
MOV
AND
ROR
CPS
BX
LDRH
UXTH
CMN
MUL
ASR
RSB
SUB
REV
LDRSB
REV16
CMP
MVN
SBC
SVC
B
Thumb-2
System, OS
NOP
SEV
WFI
DMB
MRS
MSR
DSB
ISB
YIELD
WFE
6

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