MCIMX251AVM4 Freescale Semiconductor, MCIMX251AVM4 Datasheet - Page 125
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MCIMX251AVM4
Manufacturer Part Number
MCIMX251AVM4
Description
IC MPU I.MX25 AUTO 400MAPBGA
Manufacturer
Freescale Semiconductor
Series
i.MX25r
Datasheet
1.MCIMX255AJM4.pdf
(140 pages)
Specifications of MCIMX251AVM4
Core Processor
ARM9
Core Size
32-Bit
Speed
400MHz
Connectivity
1-Wire, CAN, EBI/EMI, Ethernet, I²C, MMC, SmartCard, SPI, SSI, UART/USART, USB OTG
Peripherals
DMA, I²S, POR, PWM, WDT
Number Of I /o
128
Program Memory Type
External Program Memory
Ram Size
144K x 8
Voltage - Supply (vcc/vdd)
1.15 V ~ 1.52 V
Data Converters
A/D 3x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
400-LFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MCIMX251AVM4
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
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4.2
Table 100
Freescale Semiconductor
•
•
•
Contact Name
NGND_ADC
MPLL_GND
FUSE_VDD
MPLL_VDD
Maximum solder bump diameter measured parallel to datum A.
Datum A, the seating plane, is determined by the spherical crowns of the solder bumps.
Parallelism measurement shall exclude any effect of mark on top surface of package.
BATT_VDD
Table 100. 17×17 mm Package Ground, Power Sense, and Reference Contact Assignments
Ground, Power, Sense, and Reference Contact Assignments
Case 17x17 mm, 0.8 mm Pitch
shows the 17×17 mm package ground, power, sense, and reference contact assignments.
i.MX25 Applications Processor for Automotive Products, Rev. 8
P10
T17
U17
U18
Y13
Figure 98.
zzxz
17×17 i.MX25 Production Package
Contact Assignment
125
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