MCIMX251AVM4 Freescale Semiconductor, MCIMX251AVM4 Datasheet - Page 41

• Manufacturer Part Number: MCIMX251AVM4
• Description: IC MPU I.MX25 AUTO 400MAPBGA
• Manufacturer: Freescale Semiconductor
• Series: i.MX25r

Specifications of MCIMX251AVM4

• Core Processor: ARM9
• Core Size: 32-Bit
• Speed: 400MHz
• Connectivity: 1-Wire, CAN, EBI/EMI, Ethernet, I²C, MMC, SmartCard, SPI, SSI, UART/USART, USB OTG
• Peripherals: DMA, I²S, POR, PWM, WDT
• Number Of I /o: 128
• Program Memory Type: External Program Memory
• Ram Size: 144K x 8
• Voltage - Supply (vcc/vdd): 1.15 V ~ 1.52 V
• Data Converters: A/D 3x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 400-LFBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -

Note:
1. Maximum condition for tpr, tpo, tpi, and tpv: wcs model, 1.1 V, I/O 1. V, and 105 °C. Minimum condition for tpr, tpo, and tpv: bcs
2. Minimum condition for tps: wcs model, 1.1 V, I/O 1.7 V, and 105 °C. tps is measured between VIL to VIH for rising edge and
3. Maximum condition for tdit: bcs model, 1.3 V, I/O 1.9 V, and –40 °C.
4. Maximum condition for tpi and trfi: wcs model, 1.1 V, I/O 1.7 V and 105 °C. Minimum condition for tpi and trfi: bcs model, 1.3 V,
Table 30
Note:
1. Maximum condition for tpr, tpo, tpi, and tpv: wcs model, 1.1 V, I/O 1. V, and 105 °C. Minimum condition for tpr, tpo, and tpv: bcs
Freescale Semiconductor
Duty cycle
Clock frequency
Output pad transition times
Output pad propagation delay, 50%–50%
input signals and crossing of output signals
Output pad propagation delay, 40%–60%
input signals and crossing of output signals
Output enable to output valid delay,
50%–50%
Output enable to output valid delay,
40%–60%
Output pad slew rate
Output pad dI/dt
Input pad transition times
Input pad propagation delay, 50%–50%
Input pad propagation delay, 40%–60%
Output pad dI/dt
Input pad transition times
Input pad propagation delay, 50%–50%
Input pad propagation delay, 40%–60%
model, 1.3 V, I/O 1.9 V and –40 °C. Input transition time from core is 1 ns (20%–80%).
between VIH to VIL for falling edge.
I/O 1.9 V and –40 °C. Input transition time from pad is 5 ns (20%–80%).
model, 1.3 V, I/O 1.9 V and –40 °C. Input transition time from core is 1 ns (20%–80%).
shows AC parameters for DDR2 pbijtov18_33_ddr_clk I/O.
Parameter
Parameter
Table 30. AC Parameters for DDR2 pbijtov18_33_ddr_clk I/O
i.MX25 Applications Processor for Automotive Products, Rev. 8
Table 29. AC Parameters for DDR2 I/O (continued)
Symbol
Symbol
Fduty
tpo
tpo
tpv
tpv
tps
tdit
tdit
tpr
trfi
trfi
tpi
tpi
tpi
tpi
f
Condition
Condition
1.0 pF
1.0 pF
1.0 pF
1.0 pF
1.0 pF
1.0 pF
25 pF
25 pF
50 pF
25 pF
50 pF
25 pF
50 pF
25 pF
50 pF
25 pF
50 pF
25 pF
50 pF
50 pF
50 pF
25 pF
Load
Load
—
—
Rise/Fall
0.07/0.08 0.10/0.12 0.17/0.20
0.83/0.99 1.23/1.49 1.79/2.04
1.65/1.81 2.05/2.31 2.60/2.84
0.53/0.52
1.01/0.98
1.47/1.38
1.75/1.67
1.32/1.28
1.66/1.65
1.40/1.37
1.67/1.66
0.86/0.98
0.07/0.08 0.10/0.12
0.89/0.87 1.41/1.37
1.71/1.69 2.22/2.18
Rise/Fall
0.46/054
1.3/1.21
1.59/1.5
Min.
Min.
65
70
40
72
77
—
0.80/0.72
1.49/1.34
1.97/1.84
2.37/2.24
2.13/2.00
2.54/2.40
2.11/2.00
2.61/2.50
2.16/2.06
2.56/2.45
0.72/0.81
1.35/1.5
Typ.
Typ.
157
167
172
183
50
—
Rise/Fall
3.072/2.87
1.19/1.04
2.21/1.90
2.91/2.71
3.48/3.28
3.65/3.45
3.31/3.12
4.06/3.81
3.30/3.13
3.89/3.67
2.15/2.19
1.12/1.16
0.17/0.20
2.16/2.07
2.98/2.88
Rise/Fall
Max.
373
396
Max.
133
400
422
60
mA/ns
Units
mA/ns
Units
ns
ns
ns
MHz
V/ns
ns
ns
ns
ns
ns
ns
ns
ns
%
Notes
Notes
3
4
—
—
1
1
1
1
1
2
3
4
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