MCIMX251AVM4 Freescale Semiconductor, MCIMX251AVM4 Datasheet - Page 138

• Manufacturer Part Number: MCIMX251AVM4
• Description: IC MPU I.MX25 AUTO 400MAPBGA
• Manufacturer: Freescale Semiconductor
• Series: i.MX25r

Specifications of MCIMX251AVM4

• Core Processor: ARM9
• Core Size: 32-Bit
• Speed: 400MHz
• Connectivity: 1-Wire, CAN, EBI/EMI, Ethernet, I²C, MMC, SmartCard, SPI, SSI, UART/USART, USB OTG
• Peripherals: DMA, I²S, POR, PWM, WDT
• Number Of I /o: 128
• Program Memory Type: External Program Memory
• Ram Size: 144K x 8
• Voltage - Supply (vcc/vdd): 1.15 V ~ 1.52 V
• Data Converters: A/D 3x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 400-LFBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -

5
Table 104
138
Rev.
8
7
6
5
4
3
2
1
0
Revision History
summarizes revisions to this document.
01/2011
09/2010
08/2010
06/2010
03/2010
10/2009
6/2009
Date
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This revision number was skipped so the Consumer/Industrial and Automotive revision numbers
can be in sync.
This revision number was skipped so the Consumer/Industrial and Automotive revision numbers
can be in sync.
Initial release.
• Updated the first paragraph of
• Updated
• Updated the third note for
• Added
• Added
• In
• In
• Added a note for the line NVCC_DRYICE in
• Updated
• Added
• Updated
• Updated
• Updated
• Updated
• Added
• Added
• Updated
• Updated DRYICE description in
• Updated REF signal description in
• Updated ESD damage immunity values in
• Updated values in
• Added a note on timing in
• Added
• Updated
• Updated values in
• Updated
updated to 133 MHz.
specification has been updated to 133 MHz.
Sense, and Reference Contact Assignments," on page
FUSE_VDD.
i.MX25 Applications Processor for Automotive Products, Rev. 8
Table 27, "AC Parameters for SDRAM I/O," on page
Table 28, "AC Parameters for SDRAM pbijtov18_33_ddr_clk I/O," on page
Table 9, "Recommended External Crystal Specifications," on page
Table 10, "Recommended External Reference Clock Specifications," on page
Section 3.2.3, “SRTC DryIce Power-Up/Down Sequence.”
Table
Section 3.3, “Power Characteristics.”
Table
Table 4, "Signal Considerations," on page 9
Table 101, "17×17 mm Package i.MX25 Signal Contact Assignment," on page
Table 56, "WEIM Bus Timing Parameters," on page 71
Table 6, "DC Operating Conditions," on page 11
Table
Table
Table 1, “Ordering Information,”
Table
Table
2,
14,
1,
1,
55,
85,
“i.MX25 Parts Functional Differences.”
“iMX25 Reduced Power Mode Current Consumption.”
“Ordering Information,”
“Ordering Information,”
Table 104. Revision History
Table
Table
“NFC Timing Parameters.”
“Touchscreen ADC Electrical Specifications.”
13,
56,
Table 6, "DC Operating Conditions," on page 11.
Section 3.2.1, “Power-Up Sequence.”
“i.MX25 Power Mode Current Consumption.”
“WEIM Bus Timing Parameters.
Section 3.2.3, “SRTC DryIce Power-Up/Down Sequence.”
Table
Table
3,
“i.MX25 Digital and Analog Modules.”
4,
to include new part numbers.
to include new part numbers.
to include new part numbers.
Revision
Table
“Signal Considerations.”
Table 100, "17 × 17 mm Package Ground, Power
5,
“DC Absolute Maximum Ratings.”
for NVCC_DRYICE signal.
37, the frequency specification has been
125.
to include Min and Max values of
to include new row for WE19.
Freescale Semiconductor
13.
38, the frequency
13.
127.