TFA9879HN/N1,157 NXP Semiconductors, TFA9879HN/N1,157 Datasheet - Page 55

• Manufacturer Part Number: TFA9879HN/N1,157
• Description: IC AMP AUDIO DGTL MONO D 24HVQFN
• Manufacturer: NXP Semiconductors
• Type: Class Dr

Specifications of TFA9879HN/N1,157

• Output Type: 1-Channel (Mono)
• Package / Case: 24-VFQFN Exposed Pad
• Max Output Power X Channels @ Load: 2.75W x 1 @ 4 Ohm
• Voltage - Supply: 2.5 V ~ 5.5 V
• Features: Depop, Digital Inputs, I²C, I²S, Mute, Short-Circuit and Thermal Protection, Tone and Volume Control
• Mounting Type: Surface Mount
• Product: Class-D
• Output Power: 2.75 W
• Thd Plus Noise: 0.02 %
• Operating Supply Voltage: 3.7 V
• Supply Current: 5.7 mA
• Mounting Style: SMD/SMT
• Audio - Load Impedance: 4 Ohms, 8 Ohms
• Audio Load Resistance: 4 Ohms, 8 Ohms
• Input Signal Type: Serial
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 2.5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

NXP Semiconductors
TFA9879
Product data sheet
17.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 42.
Table 43.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
≥ 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 42
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
All information provided in this document is subject to legal disclaimers.
43
29.
Rev. 02 — 15 October 2010
Package reflow temperature (°C)
Volume (mm
< 350
235
220
Package reflow temperature (°C)
Volume (mm
< 350
260
260
250
Mono BTL class-D audio amplifier with digital input
3
3
)
)
Figure
350 to 2000
260
250
245
29) than a SnPb process, thus
≥ 350
220
220
245
> 2000
260
245
TFA9879
© NXP B.V. 2010. All rights reserved.
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