PCA9507DP,118 NXP Semiconductors, PCA9507DP,118 Datasheet - Page 17
![I/O Expanders, Repeaters & Hubs LEVEL TRANSL I2C BUS](/photos/16/10/161075/pca-tssop-8_sml.jpg)
PCA9507DP,118
Manufacturer Part Number
PCA9507DP,118
Description
I/O Expanders, Repeaters & Hubs LEVEL TRANSL I2C BUS
Manufacturer
NXP Semiconductors
Series
-r
Datasheet
1.PCA9507DP118.pdf
(20 pages)
Specifications of PCA9507DP,118
Logic Family
SDA, SCL
Propagation Delay Time
218 ns
Operating Supply Voltage
2.7 V to 5.5 V
Power Dissipation
100 mW
Operating Temperature Range
- 40 C to + 85 C
Logic Type
I2C Bus
Mounting Style
SMD/SMT
Output Current
50 mA
Output Voltage
0.52 V
Package / Case
TSSOP-8
Mounting Type
Surface Mount
Voltage - Supply
2.7 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Interface
I²C, SMBus
Number Of I /o
24
Frequency - Clock
400kHz
Interrupt Output
No
Includes
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
935285824118 PCA9507DP-T
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PCA9507DP,118
Manufacturer:
MCC
Quantity:
40 000
Part Number:
PCA9507DP,118
Manufacturer:
NXP/恩智浦
Quantity:
20 000
NXP Semiconductors
PCA9507_1
Product data sheet
13.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 7.
Table 8.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
2.5
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 7
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
8
19.
Rev. 01 — 7 February 2008
2-wire serial bus extender for HDMI DDC I
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
3
3
)
)
Figure
350 to 2000
260
250
245
19) than a SnPb process, thus
220
220
350
> 2000
260
245
245
2
PCA9507
C-bus and SMBus
© NXP B.V. 2008. All rights reserved.
17 of 20