LFXP20C-3FN256C Lattice, LFXP20C-3FN256C Datasheet - Page 394
![FPGA - Field Programmable Gate Array 19.7K LUTS 188 I/O](/photos/16/15/161505/landingpagelatticexp2_sml.jpg)
LFXP20C-3FN256C
Manufacturer Part Number
LFXP20C-3FN256C
Description
FPGA - Field Programmable Gate Array 19.7K LUTS 188 I/O
Manufacturer
Lattice
Specifications of LFXP20C-3FN256C
Number Of Programmable I/os
188
Data Ram Size
405504
Supply Voltage (max)
3.465 V
Maximum Operating Temperature
+ 90 C
Minimum Operating Temperature
0 C
Mounting Style
SMD/SMT
Supply Voltage (min)
1.71 V
Package / Case
FPBGA-256
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LFXP20C-3FN256C
Manufacturer:
Lattice
Quantity:
135
Company:
Part Number:
LFXP20C-3FN256C
Manufacturer:
Lattice Semiconductor Corporation
Quantity:
10 000
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Lattice Semiconductor
Revision History
September 2006
September 2010
November 2005
February 2010
January 2005
August 2010
March 2008
March 2010
June 2006
May 2009
Date
Version
01.0
01.1
01.2
01.3
01.4
01.5
01.6
01.7
01.8
01.9
Initial release.
Figures updated.
Removed NSMD content.
Added note to BGA Board Layout Recommendations table.
Reformatted BGA Package Types section in tabular format.
Revised recommended Solder Mask Defined and Non Solder Mask
Defined PCB solder pad dimensions to match industry standards.
Updated BGA Board Layout Recommendations table and BGA Pack-
age Types table for 0.4 mm pitch ucBGA package.
Edits to most sections and additional links and graphics added for each
example.
Replaced Lattice BGA Naming Conventions table with Lattice Semicon-
ductor BGA Package Types table and SMD/NSMD Pad Recommenda-
tions table.
Lattice Semiconductor SMD/NSMD Pad Recommendations table:
Specified nominal Solder Mask Opening for each Lattice BGA package,
clarified recommended Solder Mask Opening and Solder Pad Diame-
ters and added cautionary note.
Lattice Semiconductor SMD/NSMD Pad Recommendations table -
Added 64 csBGA to 0.5mm pitch column.
14-19
Change Summary
PCB Layout Recommendations
for BGA Packages
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