AGL125V2-FGG144 Actel, AGL125V2-FGG144 Datasheet - Page 34
![FPGA - Field Programmable Gate Array 125K System Gates](/photos/16/15/161502/landingpageacteligloofpga_sml.jpg)
AGL125V2-FGG144
Manufacturer Part Number
AGL125V2-FGG144
Description
FPGA - Field Programmable Gate Array 125K System Gates
Manufacturer
Actel
Datasheet
1.AGL030V2-CSG81.pdf
(236 pages)
Specifications of AGL125V2-FGG144
Processor Series
AGL125
Core
IP Core
Maximum Operating Frequency
526.32 MHz, 892.86 MHz
Number Of Programmable I/os
97
Data Ram Size
36864
Supply Voltage (max)
1.575 V
Maximum Operating Temperature
+ 70 C
Minimum Operating Temperature
0 C
Development Tools By Supplier
AGL-Icicle-Kit, AGL-Dev-Kit-SCS, Silicon-Explorer II, Silicon-Sculptor 3, SI-EX-TCA, FlashPro 4, FlashPro 3, FlashPro Lite
Mounting Style
SMD/SMT
Supply Voltage (min)
1.14 V
Number Of Gates
125 K
Package / Case
FPBGA-144
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
AGL125V2-FGG144
Manufacturer:
Microsemi SoC
Quantity:
10 000
Company:
Part Number:
AGL125V2-FGG144I
Manufacturer:
ON
Quantity:
20 000
Company:
Part Number:
AGL125V2-FGG144I
Manufacturer:
Microsemi SoC
Quantity:
10 000
Part Number:
AGL125V2-FGG144I
Manufacturer:
ACTEL/爱特
Quantity:
20 000
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IGLOO DC and Switching Characteristics
User I/O Characteristics
Figure 2-3 • Timing Model
2- 20
I/O Banks only)
to Advanced
(Applicable
LVPECL
(Applicable for
Advanced I/O
t
PY
Banks only)
= 0.87 ns (Advanced I/O Banks)
Clock
M-LVDS
Input LVTTL
BLVDS,
LVDS,
Timing Model
Operating Conditions: Std. Speed, Commercial Temperature Range (T
VCC = 1.425 V, for DC 1.5 V Core Voltage, Applicable to V2 and V5 Devices
t
PY
(Non-Registered)
(Registered)
= 1.20 ns
I/O Module
I/O Module
t
t
t
PY
ICLKQ
ISUD
= 1.35 ns
= 0.47 ns
= 0.43 ns
D
Q
Register Cell
t
t
CLKQ
SUD
D
= 0.82 ns
= 0.90 ns
Combinational Cell
Q
(Advanced I/O Banks)
Combinational Cell
t
PD
Combinational Cell
t
PD
Clock
Input LVTTL
t
PY
= 1.80 ns
t
= 1.22 ns
PD
= 0.87 ns
= 0.92 ns
Combinational Cell
Combinational Cell
Y
Y
t
PD
t
PD
Y
= 1.49 ns
= 0.86 ns
R ev i sio n 1 8
Register Cell
Combinational Cell
t
t
CLKQ
SUD
D
t
PD
Y
Y
= 0.82 ns
(Non-Registered)
= 0.90 ns
= 1.20 ns
(Advanced I/O Banks)
t
Q
I/O Module
DP
Clock
t
Input LVTTL
PY
= 3.05 ns (Advanced I/O Banks)
(Non-Registered)
(Non-Registered)
t
t
DP
I/O Module
I/O Module
DP
= 0.87 ns
Y
= 4.42 ns (Advanced I/O Banks)
= 4.12 ns (Advanced I/O Banks)
(Non-Registered)
I/O Module
t
DP
LVTTL Output drive strength = 12 mA
= 1.72 ns
t
t
D
OCLKQ
OSUD
(Registered)
I/O Module
LVTTL Output drive strength = 8 mA
LVCMOS 1.5 V Output drive strength = 4 mA
High slew rate
Q
= 0.52 ns
= 1.02 ns
t
(Advanced I/O Banks)
DP
High slew rate
= 3.05 ns
LVPECL (Applicable to
Advanced I/O Banks Only)L
J
= 70°C), Worst-Case
High slew rate
LVTTL 3.3 V Output drive
strength = 12 mA High slew rate
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