ML610Q412P-NNNTB03A7 Rohm Semiconductor, ML610Q412P-NNNTB03A7 Datasheet - Page 9

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ML610Q412P-NNNTB03A7

Manufacturer Part Number
ML610Q412P-NNNTB03A7
Description
MCU 8BIT 16K FLASH 120-TQFP
Manufacturer
Rohm Semiconductor

Specifications of ML610Q412P-NNNTB03A7

Core Processor
nX-U8/100
Core Size
8-Bit
Speed
625kHz
Connectivity
I²C, SSP, UART/USART
Peripherals
LCD, POR, PWM, WDT
Number Of I /o
14
Program Memory Size
16KB (8K x 16)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
1.1 V ~ 3.6 V
Data Converters
A/D 2x12b, 2x24b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ML610Q412P-NNNTB03A7
Manufacturer:
ROHM
Quantity:
750
Part Number:
ML610Q412P-NNNTB03A7
Manufacturer:
Rohm Semiconductor
Quantity:
10 000
OKI Semiconductor
ML610Q411/ML610Q415 Chip Pin Layout & Dimension
SEG21
SEG22
SEG23
SEG24
SEG25
SEG26
SEG27
SEG28
SEG29
SEG30 100
SEG31 101
SEG32 102
SEG33 103
SEG34 104
SEG35 105
PA0 106
PA1 107
PA2 108
PA3 109
PA4 110
PA5 111
PA6 112
PA7 113
* Dummy pad
Note: These dummy pads are visible and do have any function, they are placed for a mechanical evaluation
in Oki semiconductor. Please do NOT implement wire-bonding to the dummy pad.
91
92
93
94
95
96
97
98
99
*
Figure 5 ML610Q411/ML610Q415 Chip Layout & Dimension
Chip size:
PAD count:
Minimum PAD pitch:
PAD aperture:
Chip thickness:
Voltage of the rear side of chip:
2.836mm
2.836mm x 2.636mm
95 pins
80 μm
70 μm × 70 μm
350 μm
V
SS
level
ML610Q411/ML610Q412/ML610Q415
47 VSS
46 VDD
45 VSS
44 P03
43 P02
42 P01
41 P00
40 NMI
39 P11
38 P10
37 (NC)
36 AIN1
35 AIN0
2.636mm
FEDL610Q411-01
9/36

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