X28HC64J-12 Intersil, X28HC64J-12 Datasheet - Page 16
![IC EEPROM 64KBIT 120NS 32PLCC](/photos/18/29/182917/x28hc64j-12_sml.jpg)
X28HC64J-12
Manufacturer Part Number
X28HC64J-12
Description
IC EEPROM 64KBIT 120NS 32PLCC
Manufacturer
Intersil
Datasheet
1.X28HC64D-12.pdf
(17 pages)
Specifications of X28HC64J-12
Format - Memory
EEPROMs - Parallel
Memory Type
EEPROM
Memory Size
64K (8K x 8)
Speed
120ns
Interface
Parallel
Voltage - Supply
4.5 V ~ 5.5 V
Operating Temperature
0°C ~ 70°C
Package / Case
32-LCC (J-Lead)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
X28HC64J-12
Manufacturer:
XICOR
Quantity:
3 198
Company:
Part Number:
X28HC64J-12
Manufacturer:
XICOR
Quantity:
5 510
Part Number:
X28HC64J-12
Manufacturer:
XICOR
Quantity:
20 000
Company:
Part Number:
X28HC64J-12T1
Manufacturer:
INTERSIL
Quantity:
4 219
Part Number:
X28HC64J-12TZ
Manufacturer:
INTERSIL
Quantity:
20 000
Small Outline Plastic Packages (SOIC)
NOTES:
10. Controlling dimension: MILLIMETER. Converted inch dimen-
N
1
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
4. Dimension “E” does not include interlead flash or protrusions. In-
5. The chamfer on the body is optional. If it is not present, a visual
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
0.25(0.010)
of Publication Number 95.
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
terlead flash and protrusions shall not exceed 0.25mm (0.010
inch) per side.
index feature must be located within the crosshatched area.
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
sions are not necessarily exact.
2
-A-
INDEX
AREA
3
e
B
D
M
C A
SEATING PLANE
M
-C-
E
-B-
B S
A
16
H
A1
α
0.10(0.004)
0.25(0.010)
M
L
h x 45
B
M
o
C
X28HC64
M28.3
28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
A1
A
B
C
D
E
H
N
α
e
h
L
(JEDEC MS-013-AE ISSUE C)
0.0926
0.0040
0.013
0.0091
0.6969
0.2914
0.394
0.01
0.016
MIN
0
o
0.05 BSC
INCHES
28
0.1043
0.0118
0.0200
0.0125
0.7125
0.2992
0.419
0.029
0.050
MAX
8
o
17.70
10.00
MILLIMETERS
2.35
0.10
0.33
0.23
7.40
0.25
0.40
MIN
0
o
1.27 BSC
28
18.10
10.65
MAX
2.65
0.30
0.51
0.32
7.60
0.75
1.27
8
o
August 28, 2009
Rev. 0 12/93
NOTES
FN8109.2
9
3
4
5
6
7
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